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Journal of Materials Research
November 2005— Volume 20, Number 11


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Strain rate sensitivity of a nanocrystalline Cu-Ni-P alloy

J. Chen, Y.N. Shi, and K. Lu
Shenyang National Laboratory for Materials Science (SYNL), Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People's Republic of China

Nanoindentation technique was used to measure the strain rate sensitivity (m) of a nanocrystalline Cu-Ni-P alloy prepared by means of electrodeposition. The m value decreases from 0.034 to 0.018 when the nominal grain size increases from 7 nm to 33 nm. Both m values of the alloy are obviously lower than those of the pure Cu with similar grain size, implying that P segregation at grain boundaries might play a key role in retarding grain boundary activities as compared to pure Cu samples.

© 2005 MRS

Complete article available shortly.

DOI: 10.1557/JMR.2005.0387

Order number: JA511-012

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