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| Suggested format for citation of papers in this volume: |
| List all author names: Title of article, in Thin Films—Stresses and Mechanical Properties XI, edited by Thomas E. Buchheit, Andrew M. Minor, Ralph Spolenak, and Kazuki Takashima (Mater. Res. Soc. Symp. Proc. 875, Warrendale, PA , 2005), insert paper number. |
Advanced Resonant-Ultrasound Spectroscopy for Studying Anisotropic Elastic Constants of Thin Films O1.1
Hirotsugu Ogi, Nobutomo Nakamura, Hiroshi Tanei, and Masahiko Hirao
Elastic Constants and Graphitic Grain Boundaries of Nanocrystalline CVD-Diamond Thin Films: Resonant Ultrasound Spectroscopy and Micromechanics Calculation O1.2
Hirotsugu Ogi, Nobutomo Nakamura, Hiroshi Tanei, Ryuji Ikeda, Masahiko Hirao, and Mikio Takemoto
Mechanical Properties and Size Effect in Nanometric W/Cu Multilayers O1.3
P. Villain, D. Faurie, P.-O. Renault, E. Le Bourhis, P. Goudeau, and K.-F. Badawi
Improvement of the Elastic Modulus of Micromachined Structures Using Carbon Nanotubes O1.5
Prasoon Joshi, Nicolás B. Duarte, Abhijat Goyal, Awnish Gupta, Srinivas A. Tadigadapa, and Peter C. Eklund
Micro/Nano Indentation and Micro-FTIR Spectroscopy Study of Weathering of Coated Engineering Thermoplastics O2.2
Samik Gupta, Jan Lohmeijer, Savio Sebastian, Nisha Preschilla, and Amit Biswas
Mechanical Characterization of Multilayer Thin Film Stacks Containing Porous Silica Using Nanoindentation and the Finite Element Method O2.3
Ke Li, Subrahmanya Mudhivarthi, Sunil Saigal, and Ashok Kumar
Depth-Dependent Hardness Characterization by Nanoindentation using a Berkovich Indenter With a Rounded Tip O2.4
Ju-Young Kim, David T. Read, and Dongil Kwon
Atomic-Scale Analysis of Strain Relaxation Mechanisms in Ultra-Thin Metallic Films O3.2/BB2.2
M. Rauf Gungor and Dimitrios Maroudas
Investigation of the Deformation Behavior in Nanoindented Metal/Nitride Multilayers by Coupling FIB-TEM and AFM Observations O3.8/BB2.8
G. Abadias, C. Tromas, Y.Y. Tse, and A. Michel
Thermal Plasma Chemical Vapor Deposition of Superhard Nanostructured Si-C-N Coatings O3.10/BB2.10
Nicole J. Wagner, Megan J. Cordill, Lenka Zajickova, William W. Gerberich, and Joachim V.R. Heberlein
Depth Profiling of Mechanical Properties on the Nanoscale of Single-Layer and Stepwise Graded DLC Films by Nanoindentation and AFM O3.11/BB2.11
C. Ziebert, S. Ulrich, and M. Stüber
Experiments on the Elastic Size Dependence of LPCVD Silicon Nitride O4.1
Yuxing Ren and David C. C. Lam
Thermomechanical Behavior and Properties of Passivated PVD and ECD Cu Thin Films O4.5
M. Gregoire, S. Kordic, P. Gergaud, O. Thomas, and M. Ignat
A Model for Curvature in Film-Substrate System O4.6
G. Vanamu, T.A. Khraishi, and A.K. Datye
Elastic Behavior of Fibrer-Textured Gold Films by Combining Synchrotron X-ray Diffraction and In Situ Tensile Testing O4.7
D. Faurie, P.-O. Renault, E. Le Bourhis, and P. Goudeau
A Microtensile Set Up for Characterising the Mechanical Properties of Films O4.8
B. Cyziute, L. Augulis, J. Bonneville, P. Goudeau, B. Lamongie, S. Tamulevicius, and C. Templier
Characterization of Stress Relaxation, Dislocations and Crystallographic Tilt Via X-ray Microdiffraction in GaN (0001) Layers Grown by Maskless Pendeo-Epitaxy O4.9
R.I. Barabash, G.E. Ice, W. Liu, S. Einfeldt, D. Hommel, A.M. Roskowski, R.F. Davis
X-ray Diffraction Characterization of Suspended Structures for MEMS Applications O4.11
P. Goudeau, N. Tamura, B. Lavelle, S. Rigo , T. Masri, A. Bosseboeuf, T. Sarnet, J.-A. Petit, and J.-M. Desmarres
Stress Analysis of Strained Superlattices O4.13
R. Peleshchak and H. Khlyap
Experimental and Theoretical Investigations of the Magnetic Phases of Epitaxially Grown EuSe at Low Fields and Temperatures O4.14
K. Rumpf, P. Granitzer, and H. Krenn
Observation of Micro-Tensile Behavior of Thin Film TiN and Au Using ESPI Technique O4.15
Yong-Hak Huh, Dong-Iel Kim, Jun-Hee Hahn, Gwang-Seok Kim, Chang-Doo Kee, Soon-Chang Yeon, and Yong Hyub Kim
Analysis of Film Residual Stress on a of 4-Point Bend Test for Thin Film Adhesion O4.18
Sassan Roham and Timothy Hight
Practical Work of Adhesion of Polymer Coatings Studied by Laser Induced Delamination O4.19
A. Fedorov, J.Th.M. De Hosson, R. van Tijum, W.-P. Vellinga
Strain Relaxation in Si1-xGex Thin Films on Si (100) Substrates: Modeling and Comparisons With Experiments O4.21
Kedarnath Kolluri, Luis A. Zepeda-Ruiz, Cheruvu S. Murthy, and Dimitrios Maroudas
Comparison Between In Situ Annealing and External Annealing for Barium Ferrite Thin Films Made by RF Magnetron Sputtering O4.22
A.R. Abuzir and W.J. Yeh
Correlation Between Elastic Constants and Magnetic Anisotropy in Co/Pt Superlattice Thin Films O4.23
Nobutomo Nakamura, Hirotsugu Ogi, Teruo Ono, Masahiko Hirao, Takeshi Yasui, and Osamu Matsuda
Hillock Formation and Thermal Stresses in Thin Au Films on Si Substrates O5.2
Linda Sauter, T. John Balk, Gerhard Dehm, Julie A. Nucci, and Eduard Arzt
How Stretchable Can We Make Thin Metal Films? O5.5
Candice Tsay, Stephanie P. Lacour, Sigurd Wagner, Teng Li, and Zhigang Suo
An Investigation of Film Thickness Effect on Mechanical Properties of Au Films Using Nanoindentation Techniques O5.6
Yifang Cao, Zong Zong, and Wole Soboyejo
Fabrication and Composition Control of NiTi Shape Memory Thin Films for Microactuators O6.4
David J. Getchel and Richard N. Savage
Influence of Gas Atmosphere on the Plasticity of Metal Thin Films O6.5
T. Wübben, G. Dehm, and E. Arzt
Laser Lateral Crystallization of Thin Au and Cu Films on SiO2 O6.6
J.E. Kline and J.P. Leonard
A New Dislocation-Dynamics Model and Its Application in Thin Film-Substrate Systems O7.4
E.H. Tan and L.Z. Sun
Thermal Expansion of Low Dielectric Constant Thin Films by High-Resolution X-Ray Reflectivity O8.2
Kazuhiko Omote and Yoshiyasu Ito
Investigation of Local Stress Fields: Finite Element Modeling and High Resolution X-ray Diffraction O8.3
A. Loubens, C. Rivero, Ph. Boivin, B. Charlet, R. Fortunier, and O. Thomas
In Situ TEM Study of Plastic Stress Relaxation Mechanisms and Interface Effects in Metallic Films O9.1
Marc Legros, Gerhard Dehm, and T. John Balk
Fiber-Optics Low-Coherence Integrated Metrology for In Situ Non-Contact Characterization of Wafer Curvature for Wafers Having Non-Uniform Substrate and Thin Film Thickness O9.4
Wojciech J. Walecki, Alexander Pravdivtsev, Kevin Lai, Manuel Santos II, Georgy Mikhaylov, Mihail Mihaylov, and Ann Koo
In Situ Observations on Crack Propagation Along Polymer/Glass Interfaces O10.3
W.P.Vellinga, R.Timmerman, R.van Tijum, and J.Th.M. De Hosson
Strain Mapping on Gold Thin Film Buckling and Silicon Blistering O10.4
P. Goudeau, N. Tamura , G. Parry, J. Colin, C. Coupeau, F. Cleymand, and H. Padmore
Interfacial Adhesion of Pure-Silica-Zeolite Low-k Thin Films O10.5
Lili Hu, Junlan Wang, Zijian Li, Shuang Li, and Yushan Yan
Environmental Effects on Crack Characteristics for OSG Materials O10.6
Jeannette M. Jacques, Ting Y. Tsui, Andrew J. McKerrow, and Robert Kraft
TEM-Based Analysis of Defects Induced by AC Thermomechanical versus Microtensile Deformation in Aluminum Thin Films O11.2/B7.2
R.H. Geiss, R.R. Keller, D.T. Read, and Y.-W. Cheng
Employing Thin Film Failure Mechanisms to Form Templates for Nano-Electronics O11.3/B7.3
Rainer Adelung, Mady Elbahri, Shiva Kumar Rudra, Abhijit Biswas, Seid Jebril, Rainer Kunz, Sebastian Wille, and Michael Scharnberg
Degradation of Fracture and Fatigue Properties of MEMS Structures Under Cyclic Loading O11.4/B7.4
Jong-jin Kim and Dongil Kwon
Effect of Microstructure and Dielectric Materials on Stress-Induced Damages in Damascene Cu/Low-k Interconnects O11.6/B7.6
Young-Chang Joo, Jong-Min Paik, and Jung-Kyu Jung
Comparison of Line Stress Predictions With Measured Electromigration Failure Times O11.7/B7.7
Rao R. Morusupalli, William D. Nix, Jamshed R. Patel, and Arief S. Budiman
Stress-Induced Void Formation in Passivated Cu Films O11.8/B7.8
Dongwen Gan, Bin Li and Paul S. Ho
Stress Generation in PECVD Silicon Nitride Thin Films for Microelectronics Applications O11.9/B7.9
M. Belyansky, N. Klymko, A. Madan, A. Mallikarjunan, Y. Li, A. Chakravarti, S. Deshpande, A. Domenicucci, S. Bedell, E. Adams, J. Coffin, L. Tai, S-P. Sun, J. Widodo, and C-W Lai
The Effect of Microstructural Inhomogeneity on Grain Boundary Diffusion Creep O12.2
Kanishk Rastogi and Dorel Moldovan
Fracture and Deformation of Thermal Oxide Films on Si (100) Using a Femtosecond Pulsed Laser O12.6
Joel P. McDonald, Vanita R. Mistry, Katherine E. Ray, and Steven M. Yalisove
Effects of Humidity History on the Tensile Deformation Behavior of Poly(methyl–methacrylate) (PMMA) Films O12.7
Chiemi Ishiyama, Yoshito Yamamoto, and Yakichi Higo
Structural Control of Lithium Fluoride Thin Films O12.9
O.G. Yazicigil, D. Rafik, V. Vorontsov, and A.H. King
Role of Stress on the Phase Control and Dielectric Properties of (1-x) BiFeO3 - x Ba0.5Sr0.5TiO3 Solid Solution Thin Films O12.10
Chin Moo Cho, Hee Bum Hong, and Kug Sun Hong
Residual Stresses in TiO2 Anatase Thin Films Deposited on Glass, Sapphire and Si Substrates O12.13
Ibrahim A. Al-Homoudi, Linfeng Zhang, D.G. Georgiev, R. Naik, V.M. Naik, L. Rimai, K.Y. Simon Ng, R.J. Baird, G.W. Auner, and G. Newaz
Influence of Stress on Structural and Dielectric Anomaly of Bi2(Zn1/3Ta2/3)2O7 Thin Films O12.15
Jun Hong Noh, Hee Bum Hong, and Kug Sun Hong
Strain and Grain Size Effects on Epitaxial PZT Thin Films O12.19
Oscar Blanco and Jesus Heiras
Effects of Ru Vacancies and Oxygen Synthesis Pressures on the Formation of Nanodomain Structures in SrRuO3 Thin Films O12.20
Y.Z. Yoo, O. Chmaissem, S. Kolesnik , B. Dabrowski, C.W. Kimball, L. McAnelly, M. Haji-Sheikh, and A.P. Genis
Failure Analysis of Thermally Shocked NiCr Films on Mn-Ni-Co Spinel Oxide Substrates O12.21
Min-Seok Jeon, Jun-Kwang Song, Eui-Jong Lee, Yong-Nam Kim, Hyun-Gyu Shin, and Hee-Soo Lee
The Effect of Porogen on Physical Properties in MTMS-BTMSE Spin-on Organosilicates O12.24
B.R. Kim, J.M. Son, J.W. Kang, K.Y. Lee, K.K. Kang, M.J. Ko, and D.W. Gidley
Transmission Electron Microscopy Characterization of Microstructure and TiN Precipitation In Low-Energy Nitrogen Ion Implanted V-Ti Alloys O13.3
M.I. Ortíz, J.A. García, M. Varela, J.P. Rivière, R. Rodríguez, and C. Ballesteros
Nonlinear Transient Finite Element Analysis of the Relaxation Mechanisms in Strained Silicon Grown on SiGe Virtual Substrate O13.5
F. Sahtout Karoui, A. Karoui, and G. Rozgonyi
Passive Layer Formation at Ferroelectric PbTiO3/Pt Interfaces Studied by EELS O14.3
S.J. Welz, L.F. Fu, R. Erni, M. Kurasawa, P.C. McIntyre, and N.D. Browning
Intrinsic Stress and Alloying Effect in Mo/Ni Superlattices: A Comparison Between Ion Beam Sputtering and Thermal Evaporation O14.4
A. Debelle, G. Abadias, A. Michel, C. Jaouen, Ph. Guérin, M. Marteau, and M. Drouet
Kinetic Analysis and Correlation With Residual Stress of the Ni/Si System in Thin Film O14.5
F. Cacho, D. Aime, F. Wacquant, B. Froment, C. Rivero, P. Gergaud, O. Thomas, G. Cailletaud, H. Jaouen, S. Minoret, and A. Souifi
Thermal Stress Relaxation of Plasma Enhanced Chemical Vapor Deposition Silicon Nitride O14.6
P. Morin, E. Martinez , F. Wacquant, and J.L. Regolini
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