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| Suggested format for citation of papers in this volume: |
| List all author names: Title of article, in Materials, Integration and Technology for Monolithic Instruments, edited by Jeremy A.Theil, Markus Böhm, Donald S. Gardner, and Travis Blalock (Mater. Res. Soc. Symp. Proc. 869, Warrendale, PA , 2005), insert paper number. |
Vertical Integration of Hydrogenated Amorphous Silicon Devices on CMOS Circuits D1.1
N. Wyrsch, C. Miazza, C. Ballif, A. Shah, N. Blanc, R. Kaufmann, F. Lustenberger, and P. Jarron
Influence of Design Parameters on Dark Current of Vertically Integrated a-Si:H Diodes D1.2
C. Miazza, N.Wyrsch, G.Choong, S. Dunand, C. Ballif, A. Shah, N. Blanc, F. Lustenberger, R. Kaufmann, M. Despeisse, P. and Jarron
Reduction of Residual Transient Photocurrents in a Si:H Elevated Photodiode Array Based CMOS Image Sensors D1.3
Jeremy A. Theil
Thin Film on ASIC (TFA) ? A Technology for Advanced Image Sensor Applications D1.4
Juergen Sterzel and Frank Blecher
Monolithic Integration of Electronics and Sub-Wavelength Metal Optics in Deep Submicron CMOS Technology D1.5
Peter B. Catrysse
Thin-Film Color Sensor Arrays D1.6
D. Knippa, R.A. Streeta H. Stiebig, M. Krause, J.-P Lu, S. Ready, and J. Ho
Integration of Zinc Oxide Thin Films With Polyimide-Based Structures D1.7
Masashi Matsumura, Zvonimir Bandic, and Renato P. Camata
Infra-Red Photo-Detectors Monolithically Integrated with Silicon-Based Photonic Circuits D1.8
Jonathan D.B. Bradley, Paul E. Jessop, and Andrew P. Knights
Study of Sputtered Hafnium Oxide Films for Sensor Applications D2.1
H. Grüger, C. Kunath, E. Kurth, S. Sorge, and W. Pufe
Application of Magnetic Ferrite Electrodeposition and Copper Chemical Mechanical Planarization for On-Chip Analog Circuitry D2.3
Cody Washburn, Daniel Brown, Jay Cabacungan, Jayanti Venkataraman, and Santosh K. Kurinec
RF Hollow Cathode Plasma Jet Depopsition of BaxSr1-xTiO3 Films D2.4
N.J. Ianno, R.J. Soukup, Z. Hubicka, J. Olejnícek, and H. .Íchová
Optimization of the Metal/Silicon Ratio on Nickel Assisted Crystallization of Amorphous Silicon D2.5
L. Pereira, M. Beckers, R.M.S. Martins, E. Fortunato, and R. Martins
Co-Firing of Low- and Middle Permittivity Dielectric Tapes in Low-Temperature Co-Fired Ceramics D2.7
Jae-Hwan Park , Young-Jin Choi, and Jae-Gwan Park
Making Wafer Bonding Viable for Mass Production D2.8
Cher Ming Tan, Wei Bo Yu, and Wei Jun
Low Temperature Deposition of Indium Tin Oxide (ITO) Films on Plastic Substrates D2.9
Vandana Singh, B. Saswat, and Satyendra Kumar
Macroporous Silicon Sensor Arrays for Chemical and Biological Detection D3.2
Jeffrey Clarkson, Vimalan Rajalingam, Karl D. Hirschman, Huimin Ouyang, Wei Sun, and Philippe M. Fauchet
Monolithic Liquid Chemical Sensing Systems D3.3
Steven M. Martin, Timothy D. Strong, and Richard B. Brown
A CMOS Medium Density DNA Microarray with Electronic Readout D3.4
Roland Thewes, Christian Paulus, Meinrad Schienle, Franz Hofmann, Alexander Frey, Petra Schindler-Bauer, Melanie Atzesberger, Birgit Holzapfl, Thomas Haneder, and Hans-Christian Hanke
A Novel Technology to Create Monolithic Instruments for Micro Total Analysis Systems D3.8
Konstantin Seibel, Lars Schöler, Marcus Walder, Heiko Schäfer, André Schäfer, Tobias Pletzer, René Püschl, Michael Waidelich, Heiko Ihmels, Dietmar Ehrhardt, and Markus Böhm
Surface Acoustic Wave-Induced Electroluminescence Intensity Oscillation in Planar Light-Emitting Devices D4.3
Marco Cecchini, Vincenzo Piazza, Fabio Beltram, Martin Ward, Andrew Shields, Harvey Beere, and David Ritchie
Efficient Focusing With an Ultra-Low Effective-Index Lens Based on Photonic Crystals D4.4
Eugen Foca, Helmut Föll, Frank Daschner, Vladimir V. Sergentu, Jürgen Carstensen, Reinhard Knöchel, and Ion M. Tiginyanu
MBE Growth of GaAs on Si Through Direct Ge Buffers D4.5
Xiaojun Yu, Yu-Hsuan Kuo Junxian Fu, James S. Harris Jr.
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