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Mechanical Strain Evolution in Cu/low K Interconnect Lines U1.1
Paul R. Besser and Qing-Ting Jiang
Irreversible Tensile Stress Development in PECVD Silicon Nitride Films U1.6
Michael P. Hughey and Robert F. Cook
X-ray Microbeam Diffraction Measurements in Polycrystalline Aluminum and Copper Thin Films U1.7
L.E. Moyer, G.S. Cargill III, W. Yang, B.C. Larson, and G.E. Ice
Use of the Curvature Method to Determine the Misfit Stress of Epitaxial Semiconducting Systems: The Case of Samples Thinned for TEM Observation U1.9
A. Ponchet, M. Cabié, L. Durand, M. Rivoal, and A. Rocher
Dislocation Image Stresses at Free Surfaces by the Finite Element Method U2.4
Meijie Tang, Guanshui Xu, Wei Cai, and Vasily Bulatov
Phase Field Modeling of Surface Instabilities Induced by Stresses U2.10
D.J. Seol, S.Y. Hu, Z.K. Liu, S.G. Kim, W.T. Kim, K.H. Oh, and L.Q. Chen
Fracture in Thin Oxide Films U3.1
D.F. Bahr, A.L. Olson, K.R. Morasch, M.S. Kennedy, D. Rodriguez Marek, and A. Alamr
Measurement of Residual Stress in ZnO Thin Films Deposited on Silicon Wafers by the Indentation Fracture Test U3.3
Tong-Yi Zhang and Bin Huang
Thin Film Herringbone Buckling Patterns U3.4
Xi Chen and John W. Hutchinson
The Effect of Oxygen on Adhesion of Thin Copper Films to Silicon Nitride U3.6
Mengzhi Pang, Monika Backhaus-Ricoult, and Shefford P. Baker
Fracture Patterns in Thin Films and Multilayers U3.8
Alex A. Volinsky, Dirk C. Meyer, Tilmann Leisegang, and Peter Paufler
Toughness
and Contact Behavior of Conventional and Low-k Dielectric
Thin Films U4.1
Robert F. Cook, Dylan J. Morris, and Jeremy Thurn
Understanding Adhesion Failure in Low-k Dielectric Stack During Chemical-Mechanical Polishing U4.3
F. Iacopi, D. Degryse, I. Vos, M. Patz, and K.Maex
Solutions and Discussions of Thin Film Undergoing the Nonlinear Peeling U4.5
Yueguang Wei, Siqi Shu, and Ying Du
Effects of Varying Mean Stress and Stress Amplitude on the Fatigue of Polysilicon U4.7
H. Kahn, R. Ballarini, and A.H. Heuer
Fracture Behavior of Micro-Sized Specimens Prepared from a TiAl Thin Foil U4.9
K. Takashima, T.P. Halford, D. Rudinal, Y. Higo, and P. Bowen
A Membrane Deflection Fracture Experiment to Investigate Fracture Toughness of Freestanding MEMS Materials U4.10
H.D. Espinosa and B. Peng
Stress Relaxation During Isothermal Annealing at Elevated Temperatures in Electroplated Cu Films U5.1
Soo-Jung Hwang, Young-Chang Joo, and Junichi Koike
Stress and Texture in Sputter Deposited Cr Films U5.5
S. Yu. Grachev, J.-D. Kamminga, and G.C.A.M. Janssen
Thickness Dependent Stress Relaxation With the Onset of L10 Ordering in FePt Thin Films U5.8
K.W. Wierman, C.L. Platt, and J.K. Howard
Single-Crystal and Nano-Columnar Growth of Gadolinium-Doped Ceria Thin Films on Oxide Substrates Studied Using Electron Microscopy U5.9
D.X. Huang, C.L. Chen, and A.J. Jacobson
Strain Control in SrRuO3 Thin Films by Using a Lattice Constant Tunable Buffer U5.10
K. Terai, T. Ohnishi, M. Lippmaa, H. Koinuma, and M. Kawasaki
Thermal Stability and Internal Stress for Strongly (111) Oriented Cu Films U5.11
Sinji Takayama , Makato Oikawa, and Tokuji Himuro
Stress and Defect Generation in Si Epitaxy U5.12
Tien Wang and Douglas Carlson Interdiffusion in Coherent Si0.90Ge0.10/Si0.95Ge0.05 Superlattices U5.14
D.B. Aubertine and P.C. McIntyre
Evaluation on Stress and Optical Property of Thin Films Used in Optical MEMS Device U5.17
Lianchao Sun and Ping Hou
In Situ Investigation of Growth of Gold on Crystalline TiO2 and Amorphous Al2O3 Substrates U5.18
L. Lauter and R. Abermann
Formability of Ultra-Thin Plasma-Polymer Films Deposited on Metal Sheet: Mesoscopic and Nanoscopic Aspects of Defect Formation U5.23
B. Baumert, M. Stratmann, and M. Rohwerder
Investigation of Mechanical Properties of Mesoporous Methyl-Substituted SiO2 Thin Films (Methylsilesquioxane Materials) U5.26
M. Verdier, M. Montagnat, S. Maîtrejean, and G. Passemard
In Situ, Real-Time Curvature Imaging During Chemical Vapor Deposition U5.31
David A. Boyd, Ashok B. Tripathi, Mohamed El-Naggar, and David G. Goodwin
Effect of Dielectric Materials on Stress-Induced Damage Modes in Damascene Cu Lines U6.2
Jong-Min Paik, Hyun Park, Ki-Chul Park, and Young-Chang Joo
Young's Modulus Variation with Thickness of Thin Films U6.6
L.G. Zhou and Hanchen Huang
Stretchable Conductors: Thin Gold Films on Silicone Elastomer U6.9
Stéphanie P. Lacour, Sigurd Wagner, and Z. Suo
Stress-Assisted Copper-induced Lateral Growth of Polycrystalline Germanium U6.10
B. Hekmatshoar, D. Shahrjerdi, S. Mohajerzadeh , A. Khakifirooz, M. Robertson, and A. Afzali-Kusha
Probing Strain Fields About Thin Film Structures Using X-Ray Microdiffraction U7.3
C.E. Murray, I.C. Noyan, P.M. Mooney, B. Lai, and Z. Cai
Effects of the Substrate on the Determination of Hardness of Thin Films by the Nanoscratch and Nanoindentation Techniques: A Comparative Study for the Cases of Soft Film on Hard Substrate and Hard Film on Soft Substrate U7.5
Noureddine Tayebi, Andreas A. Polycarpou, and Thomas F. Conry
Dislocation Nucleation and Segregation in Nano-scale Contact of Stepped Surfaces U7.9
H.H. Yu, P. Shrotriya, J. Wang, and K.-S. Kim
Determination of Residual-Stress-Free State and Mapping of Residual Stress Fields Using Speckle Interferometry and Thermal Relaxation U7.10
Dong-Won Kim, Jong-jin Kim, Dongil Son, Nak-Kyu Lee, Kyung-Hoan Na, and Dongil Kwon
Subcritical Delamination of Dielectric and Metal Films from Low-k Organosilicate Glass (OSG) Thin Films in Buffered pH Solutions U8.1
Y. Lin, J.J. Vlassak, T.Y. Tsui, and A.J. McKerrow
Bonding Characterization of Oxidized PDMS Thin Films U8.3
J.J. McMahon, Y. Kwon, J.-Q. Lu, T.S. Cale, and R.J. Gutmann
Effects
of Process Parameters on the Adhesion of Copper Film on Polyethylene
Tetrephthalate(Pet) Substrate Prepared by ECRMOCVD Coupled with
a Periodic DC Bias U8.5
Jin Hyun, Bup Ju Jeon, Dongjin Byun , and Joong Kee Lee
Adhesion Strength of Polymer Coatings Studied by Laser Induced Delamination U8.6
A. Fedorov, A. van Veen, R. van Tijum, and J.Th.M. de Hosson
An Atomistic View of Interface-Mediated Dislocation Plasticity in Thin Metal Films U8.8
E.S. Ege and Y.-L. Shen
Dislocation Dynamics in Semiconductor Thin Film-Substrate Systems U8.9
E.H. Tan and L.Z. Sun
Microstructural Aspects of Fracture in Nanolayered TiAlCrN Thin Films U8.10
A. E. Santana, A. Karimi, V.H. Derflinger, and A. Schütze
Internal Oxidation and Mechanical Properties of Pt-IrO2 Thin Films U8.13
Richard R. Chromik, Thirumalesh Bannuru, and Richard P. Vinci
Cracking and Phase Transformation in Silicon During Nanoindentation U8.15
Jae-il Jang, Songqing Wen, M.J. Lance, I.M. Anderson, and G.M. Pharr
Scratch Test Measurements on CrNx Coatings U8.16
R. Hoy, P. van Essen, J.-D. Kamminga, G.C.A.M. Janssen, A.P. Ehiasarian
Resistance to Cracking of a Stretchable Semiconductor: Speed of Crack Propagation for Varying Energy Release Rate U8.19
Sheng Liu, Hee C. Lim, Min Qu, John F. Federici, Gordon A. Thomas, Helena Gleskova, and Sigurd Wagner
Microstructure Evolution of On-Substrate NiTi Shape
Memory Alloy Thin Films U8.20
Xi Wang, Ann Lai, Joost J. Vlassak, and Yves Bellouard
Mechanisms Controlling the Hardness of Si and Ge U8.22
L.J. Vandeperre, F. Giuliani, S.J. Lloyd, and W.J. Clegg
Computational and Experimental Characterization of Indentation Creep U8.23
Ming Dao, Hidenari Takagi, Masami Fujiwara, and Masahisa Otsuka
Tuning the Mechanical Properties of SiO2 Thin Film
for MEMS Application U8.25
Wang-Shen Su, Weileun Fang, and Ming-Shih Tsai
Optimization of Film Stresses Utilized in Composite Piezoelectric Membrane Microgenerators U8.26
M.S. Kennedy, M. Zosel, C.D. Richards, R.F. Richards, D.F. Bahr, K.W. Hipps, and N.R. Moody
Stress and Strength of Free-Standing 2-Dimensional Tetrahedral Amorphous Carbon Bridge Arrays U8.27
Daniel H.C. Chua, T.H. Tsai W.I. Milne, D. Sheeja, and B.K. Tay
Nanoindentation Behavior of Gold Single Crystals U8.30
Martha M. McCann and Sean G.Corcoran
Determination of Mechanical Parameters for Rotating MEMS Structures as a Function of Deposition Method U9.2
S. Soare, S.J. Bull, A. Oila, A.G. O'Neill, N. Wright, A. Horsfall, and J. dos Santos
Direct Observations of Grain Boundary Phenomena During Indentation of Al and Al-Mg Thin Films U9.3
W.A. Soer, J.Th.M. De Hosson, A.M. Minor, E.A. Stach, and J.W. Morris Jr.
Experimental Measurements of Surface Residual Stress Caused by Nano-scale Contact of Rough Surfaces U9.9
J. Wang, P. Shrotriya, H.H. Yu, and K.-S. Kim
Bulge Test on Free Standing Gold Thin Films U10.3
Yawen Li and Michael J. Cima
Microstructure–Mechanical Properties Relationship of Laser Interference Irradiated Ni/Al Multi-Film U10.4
C. Daniel, A. Lasagni, and F. Mücklich
Early Yielding and Stress Recovery in (111) and (100) Texture Components in Cu Thin Films Determined Using Synchrotron X-ray Diffraction U10.5
D.E. Nowak and S.P. Baker
Indentation and Finite Element Modeling Investigations of the Indentation Size Effect in Aluminium Coatings on Borosilicate Glass Substrates U10.6
I. Spary, N. M.Jennett, and A.J. Bushby
Young's Modulus, Poisson's Ratio, and Nanoscale Deformation Fields of MEMS Materials U10.9
I. Chasiotis, S.W. Cho, T.A. Friedmann, and J.P. Sullivan
Hinge Sensitivity in a Micro-Rotating Structure for predicting Induced Thermo Mechanical Stress in Integrated Circuit Metal Interconnects U10.10
J.M.M. dos Santos, K. Wang, S.M. Soare, S.J. Bull, A.B. Horsfall, N.G. Wright, A.G. O'Neill, J.G. Terry, A.J. Walton, A.M. Gundlach, and J.T.M. Stevenson
Modeling and Optimal Design of Multilayer Cantilever
Microactuators U10.11
L.H. Han and T.J. Lu
Mechanical Properties and Morphology of Polycrystalline 3C-SiC Films Deposited on Si and SiO2 by LPCVD U11.3
Xiao-an Fu, Jeremy Dunning, Srihari Rajgopal, and Ming Zhang
Residual Stress in Silicon Nitride Thin Films Deposited
by ECR-PECVD U11.4
E. Cianci and V. Foglietti
A Study on Selective Etching of SiGe Layers in SiGe/Si
Systems for Device Applications U11.8
Takashi Yamazaki, Tomohide Sekikawa, Shinya Morita, Yoshitaka
Hakamada, Hiroyuki Ohri, Shun-ichiro Ohmi, and Tetsushi Sakai
Guided Formation of Nanostructures in Thin Films U11.10
Wei Lu and Dongchoul Kim
Indentation Curve Analysis for Pile-up, Sink-In and
Tip-Blunting Effects in Sharp Indentations
U11.13
Yeol Choi, Baik-Woo Lee, Ho-Seung Lee, and Dongil Kwon
Determining Stress-strain Curves for Thin Films by
Experimental/Computational Nanoindentation
U11.14
Baik-Woo Lee, Yeol Choi, Yun-Hee Lee, Ju-Young Kim, and Dongil
Kwon
A Theoretical Study on the Indentation of Viscoelastic Materials U11.16
Guanghui Fu
Effects of Thickness and Indenter Geometry in Nanoindentation of Nickel Thin Films U11.19
Padma Parakala, Reza A. Mirshams, Seifollah Nasrazadani, and Kun Lian
Thermo-Mechanical Behavior of Fe Thin Films U11.23
Nail R. Chamsoutdinov, Amarante J. Böttger, Rob Delhez, and Frans D. Tichelaar
Thermomechanical Behavior of Tantalum Thin Films: The Effects of Oxygen and the b - a Phase Transformation U11.27
Robert Knepper, Blake Stevens, and Shefford P. Baker
Thin Film Material Parameters Derived From Full Field Nanometric Displacement Measurements in Non-Uniform MEMS Geometries U11.28
Jaime F. Cárdenas-García, Sungwoo Cho, and Ioannis Chasiotis
Temperature Dependence of Biaxial Modulus and Thermal
Expansion Coefficient of Thin Films Using Wafer Curvature Method U11.29
M. Capanu, A. Cervin-Lawry, A. Patel, I. Koutsaroff, P. Woo,
Lynda Wu, J. Oh, J. Obeng, and B. McClelland
Characterizing Thin-Film Stress Fields by Resonance of Membrane Arrays U11.32
R. Engelstad, E. Lovell, A. Chalekian, S. Janowski , M. Cash, and H. Eguchi
Measurement of Thin-Film Stress, Stiffness, and Strength Using an Enhanced Membrane Pressure-Bulge Technique U11.34
Aaron J. Chalekian, Roxann L. Engelstad, and Edward G. Lovell
Thermal-Mechanical Evaluation of Plated Electro-Magnetic NiFe for MEMS Generators U11.35
Yibin Xue, Keithan Hillman, and David Veazie
The Effects of Passivation Layer and Film Thickness on the Mechanical Behavior of Freestanding Electroplated Cu Thin Films With Constant Microstructure U11.37
Yong Xiang, Joost J. Vlassak, Maria T. Perez-Prado, Ting Y. Tsui, and Andrew J. McKerrow
Monotonic Testing and Tension-Tension Fatigue Testing of Free-Standing Al Microtensile Beams U11.39
Nicholas Barbosa III, Paul El-Deiry, and Richard P. Vinci
The Thermal Annealing Effect on the Residual Stress and Interface Adhesion in the Compressive Stressed DLC Film U11.42
Heon Woong Choi, Myoung-Woon Moon, Tae-Young Kim, Kwang-Ryeol Lee, and Kyu Hwan Oh
Effect of Monazite Coating on Tensile Properties of Nextel 720 Fibers, Tows and Minicomposites U11.43
Devdas M. Pai, Sergey Yarmolenko, Jagannathan Sankar, Balasubramanian Kailasshankar, Christopher Murphy, Edwardo Freeman, and Larry P. Zawada
Microstructure and Current Transport Properties of YBa2Cu3O7-x/(Ba0.05, Sr0.95)TiO3 Multiple-Layer Thin Films U11.46
Y. Luo, R.A. Hughes, J.S. Preston, and G.A. Botton
Stress-Field in Sputtered Mo Thin Films and Mo/Ni Superlattices: Origin and Evolution After Ion-Irradiation U12.3
A. Debelle, G. Abadias, A. Michel, C. Jaouen, Ph. Guérin, and M. Drouet
Asymmetry in Multilayer Adhesion: the Zinc Oxide/Silver Interface U12.5
E. Barthel, P. Nael, O. Kerjan, and N. Nadaud
Design Maps for the Tensile Yield Strength of Nanoscale Metallic Multilayers U12.7
Adrienne V. Lamm and Peter M. Anderson
DLC/Hydroxyapatite Nanocomposites U12.9
Roger J. Narayan
Investigation of Structural and Mechanical Properties of UV and Microwave-Irradiated Al2O3/ZrO2 Multilayers by Sol-Gel Coating U12.11
A.R. Phani and H. Haefke
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