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Low Sintering Temperature of CuO-Fluxed Ag(Nb,Ta)O3 Dielectric Ceramics B1.3
Chiping Wang, Thomas Shrout, Gaiying Yang, Hyo-Tae Kim, Do-Kyun Kwon, and Michael T. Lanagan
Wireless and RF Module Packaging Using Low Loss Ceramic and Low Loss Organic Materials B1.4
James J. Logothetis, Daniel I. Amey, and Timothy P. Mobley
Material Issues of Low Temperature Co-Fired Ceramic (LTCC) Fine Pitch Chip Scale Package (CSP) Designs B1.6
Megan M. Owens, Joseph W. Soucy, Thomas F. Marinis, Kevin A. Bruff, and Henry G. Clausen
Techniques for Assessing the Performance of Circuit Materials at Microwave and Millimeter-Wave Frequencies B1.7
Charles E. Free
In-Plane Ferroelectricity in Strontium Titanate Thin Films B2.2
K.F. Astafiev, V.O. Sherman, M. Cantoni, A.K. Tagantsev, N. Setter, P.K. Petrov, T. Kaydanova, and D.S. Ginley
High-Q Integrated RF Passives and RF-MEMS on Silicon B3.1
Joost T.M. van Beek, Marc H.W.M. van Delden, Auke van Dijken, Patrick van Eerd, Andre B.M. Jansman, Anton L.A.M. Kemmeren, Theo G.S.M. Rijks, Peter G. Steeneken, Jaap den Toonder, Mathieu J.E. Ulenaers, Arnold den Dekker, Pieter Lok, Nick Pulsford, Freek van Straten, Lenhard van Teeffelen, Jeroen de Coster, and Robert Puers
Cu-Compatible Ultra-High Permittivity Dielectrics for Embedded Passive Components B3.2
Jon F. Ihlefeld, Angus I. Kingon, William Borland, and Jon-Paul Maria
Design and Performance of Polymeric Ultra-Thin Substrates for Use as Embedded Capacitors: Comparison of Unfilled and Filled Systems With Ferroelectric Particles B3.3
John Andresakis, Takuya Yamamoto, Pranabes Pramanik, and Nick Buinno
High Frequency Loss Mechanism in Polymers Filled with Dielectric Modifiers B3.5
J. Obrzut, A. Anopchenko, K. Kano, and H. Wang
Passive Isolators Based on Barium Ferrite Sputtered Films B3.8
M. Le Berre, S. Capraro , J.P. Chatelon, H. Joisten, T. Rouiller, B. Bayard, D. Barbier, and J.J. Rousseau
Solidly Mounted Bulk Acoustic Wave Filters B4.1
H.P. Loebl, C. Metzmacher, R.F. Milsom, A. Tuinhout, P.Lok, and F.van Straten
Investigation of Highly c-Axis Oriented AlN Thin Film Re-Growth B4.2
F. Martin, P. Muralt, and M.-A. Dubois
Theoretical and Experimental Study of Barium Zinc-Cadmium Tantalate-Based Microwave Dielectrics B4.7
Shaojun Liu, Mark Van Schilfgaarde, Jian Sun, Louisa Badd, David Smith, Novak S. Petrovixc, R. Taylor, and N. Newman
Tunability of Bi-Rich BZN Cubic Pyrochlore Thin Films by Reactive Sputtering B5.3
Dong Hyuk Back, Yoon Seop Lee, Young Pyo Hong, Joong Ho Moon, and Kyung Hyun Ko
Dielectric Properties of BaTiO3 Based Ceramics Prepared From Nano-Powders B5.5
Xiao-Hui Wang, Ren-Zheng Chen, Zhi-Lun Gui, and Long-Tu Li
The Microstructures and Grain Boundary Segregations of Ceramic Barium Titanate Processed in Microwave Field B5.7
Hanxing Liu, Zhongqin Tian, Jian Zhou, Hongtao Yu, Long Zou, and Shixi Ouyang
Pulsed DC Reactive Magnetron Sputtering of AlN Thin Films on High Frequency LTCC Substrates B5.10
Jung W. Lee, Jerome J. Cuomo, Baxter F. Moody, Yong S. Cho, and Roupen L. Keusseyan
A New Dielectric Material System of xLa(Mg1/2Ti1/2)O3-(1-x)CaTiO3 at Microwave Frequency B5.11
Yuan-Bin Chen, Cheng-Liang Huang, and Che-Win Row
Ordered Structures in Ba(Cd1/3Ta2/3)O3 Microwave Ceramics: A Transmission Electron Microscopy Study B5.12
J. Sun, S.J. Liu, N. Newman, and David. J. Smith
Microwave Dielectric Proper ties of (1-x)CaTiO3-xNd(Mg1/2Ti1/2)O3 Ceramics System B5.13
Cheng-Liang Huang, Yuan-Bin Chen, and Ching-Wen Lo
Microwave Dielectric Properties of LaScO3-TiO2 Materials B5.14
Do-Kyun Kwon, Michael T. Lanagan, and Thomas R. Shrout
Rapid Prototype Fabrication of Custom Chip Scale Packages B5.16
Megan M. Owens, Joseph W. Soucy, Thomas F. Marinis, and Henry G. Clausen
High Frequency, High Density Interconnect Using AC Coupling B6.1
Paul Franzon, Angus Kingon, Stephen Mick, John Wilson, Lei Luo, Karthik Chandrasakhar, Jian Xu, Salvatore Bonafede, Alan Huffman, Chad Statler, and Richard LaBennett
High-Density, Low-Loss MOS Decoupling Capacitors Integrated in a GSM Power Amplifier B6.3
F. Roozeboom, A. Kemmeren, J. Verhoeven, E. van den Heuvel, H. Kretschman, and T. Fric
High Electron Mobility SiGe/Si Transistor Structures on Sapphire Substrates B6.5
Samuel A. Alterovitz, Carl H. Mueller, Edward T. Croke, and George E. Ponchak
RF-MEMS: Materials and Technology, Integration and Packaging B6.6
Harrie A. C. Tilmans
Photodefinable Metal Oxide Dielectrics: A Novel Method for Fabricating Low Cost RF Capacitive MEMS Switches B6.7
Guoan Wang, Augustin Jeyakumar, John Papapolymerou, and Clifford L. Henderson
Microstructural Evolution of Cu/Ta/GaAs Multilayers With Thermal Annealing B7.2
Wei-Cheng Wu, Chang-You Chen, Chen-Shih Lee, Edward Yi Chang, and Li Chang
Integration of III-V Optoelectronic Components on Si Platform B7.4
Alex Katsnelson, Vadim Tokranov, Michael Yakimov, and Serge Oktyabrsky
Improvement of Tantalum Pentoxide Metal-Insulator-Metal Capacitors for SiGe RFBiCMOS Technology B7.6
Hongjiang Sun, Ka Man Lau, Eyup Aksen, and Nancy Bell
Preparation and Use of Chip Capacitors in Ultra-Dense Multi-Chip Modules B7.8
D. Pryputniewicz, C. Kondoleon, J. Haley, and T. Marinis
Surface Oxide Evolution on Al-Si Bond Wires B7.11
Wentao Qin, Ray Doyle, Tom Scharr, Mahesh Shah, Mike Kottke, Dennis Werho, and N. David Theodore
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