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Developing Nanoscale Materials Using Biomimetic Assembly Processes A1.1
George D. Bachand, Susan B. Rivera, Andrew K. Boal, Joseph M. Bauer, Steven J. Koch, Ronald P. Manginell, Jun Liu, and Bruce C. Bunker
Carbon Nanotube Modification Using BaF2 Vapor in Ultra-High Vacuum Environment A1.3
Francisco Santiago, Victor H. Gehman Jr., Karen Long, and Kevin A. Boulais
Tunneling Current-Distance Characteristic of Scanning Vibrating Probe/1-Alkanethiol Self-Assembled Monolayer (SAM)/Au (111) Structure A1.4
Yuhsuke Yasutake, Yasuo Azuma, Kouhei Nagano, and Yutaka Majima
Poly-SiGe: A Superb Material for MEMS A2.1
Ann Witvrouw, Maria Gromova, Anshu Mehta, Sherif Sedky, Piet De Moor, Kris Baert, Chris van Hoof
Fabrication of Micro- and Nanoscale SiC Structures Using Selective Deposition Processes A2.2
L. Chen, X.A. Fu , C.A. Zorman, and M. Mehregany
Optimization of Poly-SiGe Deposition Processes for Modular MEMS Integration A2.4
Blake C.-Y. Lin, Tsu-Jae King, and Roger T. Howe
Thin-Film Electrostatic Actuators on Flexible Plastic Substrates A2.5
J. Gaspar, V. Chu, and J.P. Conde
Scanning Probe Characterization of Localized pH Changes on a Sapphire Surface in the Presence of an Applied Field A3.1
Joseph W. Bullard, Ryan J. Kershner, and Michael J. Cima
Monolithic Three-Dimensional Integration of Micro-Fluidic Channels and Optical Waveguides in Fused Silica A3.2
Yves Bellouard, Ali Said, Mark Dugan, and Philippe Bado
Damage and Failure Mechanisms in High Pressure Silicon-Glass-Metal Microfluidic Connections A3.3
Dong-Jin Shim, Hong-Wei Sun, Srikar T. Vengallatore, and S. Mark Spearing
Nanostructured Materials for Microfluidic Sensing Application A3.4
Nancy N. Kariuki, Laura Moussa, Tanya Menard, Asif Hassan, Li Han, Elizabeth Crew, Jin Luo, and Chuan-Jian Zhong
Characterization of 0.5 MHz Silicon-Based Ultrasonic Nozzles Using Multiple Fourier Horns A3.5
Shirley C. Tsai, Yu L. Song, Yuan F. Chou, Terry K. Tseng, W.J. Chen, J.H. Yang, J.W. Chen, and Chen S. Tsai
A Scheme of Micromanipulation Using a Liquid Bridge A3.6
Kenichi J. Obata, Shigeki Saito, and Kunio Takahashi
Characterization of Electrostatic Micromembrane Actuator Performance Using A Mass Probing Method A4.2
Xingtao Wu, Jeremy Hui, Pat Kayatta, Dedeian Kenneth, Mariam Young, and Cardinal Warde
Polymer Microvalve Based on Anisotropic Expansion of Polypyrrole A4.4
Yevgeny Berdichevsky and Y.-H. Lo
Self-Organized Criticality in Nanotribology A5.1
Micha Adler, John Ferrante, Alan Schilowitz, Dalia Yablon, and Fredy Zypman
Optimization of Mesoporous Silicon Microcavities for Proteomic Sensing A5.3
L.A. DeLouise and B.L. Miller
Thermal Effects in Plasma Treatment of Patterned PDMS for Bonding Stacked Channels A5.5
Jin Zou and Peter Y. Wong
Statistical Thermodynamics of Two-Dimensional Fluids of Solid Nanoparticles A5.6
Liudmila A. Pozhar and John Maguire
Single Osteoblast Chemical Sensor via Non-Invasive Bio-Electronic Interface A5.9
Mo Yang, Xuan Zhang, Bonnie Kohr, Andre Morgan, and Cengiz S. Ozkan
Ellipsometry Measurement Accuracy of Gate Oxides under Polysilicon A5.10
Gary Jiang, Don Pelcher, Daewon Kwon, Jana Clerico, and George Collins
Controlling the Position and Morphology of Nanotubes Within a Polymer Thin Film A5.11
Emer Lahiff, Andrew I. Minett, Seamus Curran, Chang Y. Ryu, Werner J. Blau, and Pulickel M. Ajayan
Fabrication of Micro-Contact Probe Using Mo-Cr Spring with Au Plating Bump A5.12
Chinami Kaneshiro and Kohji Hohkawa
Microwave Molecular Sieves Synthesis and Capillary Crystal Growth by Geometric Confinement A5.13
Steven B. Ogunwumi, John F. Wight, and James C. Fajardo
Micromechanical Characterization of GaSb by Microbeam Deflecion and Using Nanoprobe and Finite Element Analysis A5.14
M. Ospina, S.R. Vangala, D. Yang, J.A. Sherwood, C. Sung, and W.D. Goodhue
3D Small Angle X-ray Scattering (SAXS) on Deformed PVDF Foils A5.17
Guenther Maier, Gernot Wallner, and Peter Fratzl
Effects of Softbake Parameters on a Benzocyclobutene (BCB) Adhesive Wafer Bond A5.20
Daniel N. Pascual
Characterization of Mechanical Properties of Silicon Nitride Thin Films for Space Applications A5.21
Wen-Hsien Chuang, Thomas Luger, Rainer K. Fettig, and Reza Ghodssi
Polyurethane Nanofiber Webs for Sensor and Actuator Applications in Microelectromechanical Systems (MEMS) A5.29
Mustafa M. Demir, Mansoor Naseer, Thomas F. Bechteler, Yasar Gurbuz, and Yusuf Z. Menceloglu
Ceramic Microfabrication Techniques for Microdevices With Three-Dimensional Architecture A5.30
Balakrishnan Nair, Merrill Wilson, Akash Akash, Joe Crandall, Charles Lewinsohn, Raymond Cutler, and Marc Flinders
Localized, In-Situ Vacuum Measurements For MEMS Packaging A5.32
Nicholas Moelders, James T. Daly, Anton C. Greenwald, Edward A. Johnson, Mark P. McNeal, Ramesh Patel, Martin U. Pralle, and Irina Puscasu
Electromechanical Behavior in Micromachined Piezoelectric Membranes A5.33
M.C. Robinson, J.C. Raupp, I. Demir, C.D. Richards, R.F. Richards, and D.F. Bahr
Structural and Morphological Study of Zirconia and Titania Sol-Gel Monolayered Films Supported on Soda-Lime Glass Substrates A5.36
Luisa F. Cueto, Enrique Sánchez, Leticia M. Torres-Martínez, and Gustavo A. Hirata
Dissipation Mechanisms in Thin-Film Silicon Microresonators on Glass Substrates A5.37
J. Gaspar, V. Chu, and J.P. Conde
Cavitation Erosion and Friction Behavior of Stainless Steel as a Function of Grain Size A5.38
Giuseppe Bregliozzi, Syed Imad-Uddin Ahmed, Andrea Di Schino, Josè M. Kenny, and Henry Haefke
Layer-by-Layer Engineered Microreactors for Bio-Polymerization of 4-(2-aminoethyl) Phenol Hydrochloride A5.43
R. Ghan, T. Shutava, A. Patel, V. John, and Y. Lvov
Effect of Polymer Substrates on Nano Scale Hot Embossing A5.50
Jin-Hyung Lee, Hyun-Woo Lim , Jin-Goo Park, Eun-Kyu Lee, and Yangsun Kim
Evaluation of Design and Performance of a Cryogenic MEMS Micropump Realized With Si-Based Diaphragm Using Combination of ZYGO/WYKO Interferometer and Raman Spectroscopy A5.52
Yi Zhao, Daryl Ludlow, Biao Li, and Xin Zhang
Adhesion Force and Nanotribological Characteristics of Chemical Vapor Deposited Fluorocarbon Films A5.55
Nam-Kyun Kim, Tae-Gon Kim, Jin-Goo Park, Woon-Bae Kim, and Hyung- Jae Shin
A Novel AFM Chip for Fountain Pen Nanolithography—Design and Microfabrication A5.56
Keun-Ho Kim, Nicolaie Moldovan, Changhong Ke, and Horacio D. Espinosa
Novel Electro-Optic Ceramic Materials for Microchip and High Power Lasers A5.57
Xuesheng Chen, Kewen Li, Kevin Zou, Run Zhang, Hua Jiang, Gonul Ozen, and B. Di Bartolo
2D InP Etching Simulation Under High Density Plasma of Chlorine A5.62
A. Rhallabi, B. Liu, G. Marcos, and J.P. Landesman
Interface Adhesion and Reliability of Microsystem Packaging A5.64
Marvin I. Francis, Kellen Wadach, Satyajit Walwadkar, and Junghyun Cho
Pattern Formation in Directional Solidification A5.65
Mike Greenwood, Mikko Haataja, and Nikolas Provatas
Field Emission from the Carbon Nanotubes Grown Over Cylindrical Surface A5.66
D. Sarangi and A. Karimi
Electrical Characterization of BCB for Electrostatic Microelectromechanical Devices A5.69
Alireza Modafe, Nima Ghalichechian, Benjamin Kleber, and Reza Ghodssi
Measurement of Shape and Deformation of MEMS at the Wafer Level A5.72
Cosme Furlong, Curtis F. Ferguson, Michael J. Melson, and Ryszard J. Pryputniewicz
Evolution of Mesas on Si(111) Surface Under Sublimation: Nanofabrication Through the Control of Atomic Steps A5.75
Kee-Chul Chang and Jack M. Blakely
Application of FIB/SEM and TEM to Bit Failure Analyses in SRAM Arrays A5.77
Wentao Qin, Alex Volinsky, Larry Rice, Lorraine Johnston, and David Theodore
Study of High Aspect Ratio Etching in Silicon by a Mixture of SF6/O2 Using a 2-D Model Based on a Monte Carlo Approach A5.78
G. Marcos, A. Rhallabi, and P. Ranson
Advanced Anodic Bonding Processes for MEMS Applications A5.80
V. Dragoi, P. Lindner, T. Glinsner, M. Wimplinger, and S. Farrens
Mechanical Characterizations of Laser Microwelds for MEMS Packaging A5.82
Wei Han and Ryszard J. Pryputniewicz
Formation of a Ba-Te Surface on GaAs A5.84
Kevin A. Boulais, Francisco Santiago, Karen J. Long, and Victor H. Gehman
Study of the Pull-In Voltage for MEMS Parallel Plate Capacitor Actuators A5.86
Emmanuel Saucedo-Flores, Rubén Ruelas, Martín Flores, and Jung-Chih Chiao
Resist Poisoning-Free Advanced PECVD-Based Anti-Reflective Coating (ARC) for 90 nm Technology and Beyond A5.91
Sang H. Ahn, Sudha Rathi, Jean Liu, Heraldo Botelho, Wendy Yeh, Martin Seamons, Derek Witty, and Hichem M'Saad
Thermophysical Properties of Ni Films for LIGA Microsystems A6.2
Diana-Andra Borca-Tasciuc, Rajesh Nimbalkar, Gang Chen, Samuel Graham, and Theodorian Borca-Tasciuc
Mechanical Properties of Metallic Thin Films: Tensile Tests vs. Indentation Tests A6.3
Nian Zhang, Changjin Xie, and Wei Tong
Electrical Porous Silicon Microarray for DNA Hybridization Detection A7.2
Marie Archer, Marc Christophersen, Philippe M. Fauchet, Deoram Persaud, and Karl D. Hirschman
Potentiometric Detection of DNA Molecules Hybridization Using Gene Field Effect Transistor and Intercalator A7.6
Toshiya Sakata, Hidenori Otsuka, and Yuji Miyahara
Control of Stress in a Metal–Nitride–Metal Sandwich for CMOS-Compatible Surface Micromachining A8.5
Rhodri R. Davies, David J. Combes, Mark E. McNie, and Kevin M. Brunson
Microfrictional Properties of Titanium Carbide A8.6
Syed Imad-Uddin Ahmed, Giuseppe Bregliozzi, and Henry Haefke
Ferroelectric Lead Zirconate Titanate and Barium Titanate Nanoshell Tubes A9.4
Yun Luo, Izabela Szafraniak, Valanoor Nagarajan, Ralf B. Wehrspohn, Martin Steinhart, Joachim H. Wendorff, Nicolai D. Zakharov, Ramamoorthy Ramesh, and Marin Alexe
Gas Adsorption Evidence of Single-Wall and Multi-Wall Carbon Nanotube Opening A9.5
Moulay-Rachid Babaa, Edward McRae, Nicole Dupont-Pavlovsky, Sandrine Delpeux, Francois Beguin, Fabrice Valsaque, and Jaafar Ghanbaja
Fabrication and RF Properties of Titanium Carbide / Gold Coplanar Waveguides for RF MEMS Applications A10.1
G. Radhakrishnan, R.E. Robertson, P.M. Adams, S.S. Osofsky, and K.S. MacGowan
Characterization and Modeling of Wafer and Die Level Uniformity in Deep Reactive Ion Etching (DRIE) A10.2
Hongwei Sun, Tyrone Hill, Martin Schmidt, and Duane Boning
Non-Impact Electrostatic Micromanipulation by Voltage Sequence for Time A10.5
Shigeki Saito, Kunio Takahashi, and Masataka Urago
Evaluating the Mechanical Properties of MEMS by Combining the Resonance Frequency and Microtensile Methods A10.6
Dongil Son, Jong-jin Kim, Dong Won Kim, Tae Won Lim, and Dongil Kwon
Direct Writing of 3E Microstructures Using a Scanning Laser System A11.5
Hui Yu, Alexander Grüntzig, Yi Zhao, André Sharon, Biao Li, and Xin Zhang
Measurement of Work of Adhesion on Wafers for Direct Bonding A12.4
Kevin T. Turner and S. Mark Spearing
Semiconductor Surface–Molecule Interactions: A Case Study in the Wet Etching of InP by a-Hydroxy Acids A13.5
Prabhakar Bandaru
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