Volume 28, No. 1 January 2003 Masthead
A Publication of the Materials Research Society [click for larger image] © Copyright 2003 Materials Research Society All rights reserved View Cover Caption << Previous Issue | All Issues | Next Issue >> MICROELECTRONICS PACKAGING AND INTEGRATION Microelectronics Packaging and Integration, 11 R.H. Reuss and B.R. Chalamala, Guest Editors [View Abstract] [View Full Article (PDF) ] Critical Aspects of High-Performance Microprocessor Packaging, 21 V.P. Atluri, R.V. Mahajan, P.R. Patel, D. Mallik, J. Tang, V.S. Wakharkar, G.M. Chrysler, C.-P. Chiu, G.N. Choksi, R.S. Viswanath [View Abstract] [View Full Article (PDF) ] Materials for 3D Packaging of Electronic and Optoelectronic Systems, 35 V.H. Ozguz and J. Yamaguchi [View Abstract] [View Full Article (PDF) ] High-Performance Packaging of Power Electronics, 41 M.C. Shaw [View Abstract] [View Full Article (PDF) ] Packaging Options for MEMS Devices, 51 E. Jung [View Abstract] [View Full Article (PDF) ] Low-Cost Wafer-Level Vacuum Packaging for MEMS, 55 R. Gooch and T. Schimert [View Abstract] [View Full Article (PDF) ] Chip-to-Module Interconnections Using "Sea of Leads" Technology, 61 M.S. Bakir, H.A. Reed, A.V. Mulé, J.P. Jayachandran, P.A. Kohl, K.P. Martin, T.K. Gaylord, and J.D. Meindl [View Abstract] [View Full Article (PDF) ] Emerging Materials Challenges in Microelectronics Packaging, 68 D.R. Frear and S. Thomas [View Abstract] [View Full Article (PDF) ] Mayo Leads MRS Board of Directors in 2003, 75 MRS Bulletin Volume Oranizers Guide Technical Theme Topics for 2004, 77 Abstracts for February 2003 Journal of Materials Research, 78 Letter from the President, 3 MRS FAQs M.J. Mayo Research/Researchers, 4 Science Policy, 9 Advertisers in This Issue, 77 Calendar, 81 Classified, 84 Posterminaries, 88 Explain Yourself A. King		Buy this Issue Full Articles of this issue are available online to MRS Members in Acrobat PDF format If you are not yet a Member, you can join now by filling out the Online Membership Application In This Issue • Classifieds • Advertisers Go To • Bulletin Home • Archives • Staff Contacts Online Resources • Web Resources for Microelectronics Packaging • Related MRS Proceedings Volumes ON THE COVER: Microelectronics Packaging and Integration. (left) Schematic cross section of a typical power package for an adjustable-speed motor drive or rf power amplifier (not to scale), and a high-magnification optical photograph of a polished cross section through a commercially available module. (upper right and background cover) Scanning electron microscopy images of an array of S-shaped compliant metal leads fabricated above a polymer film embedded with highly compressible air gaps. (center right) An 84-pin ceramic package showing mounted arrays. (lower right) Wire-bond interconnects. See the technical theme that begins on p. 11.

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