January 2003
Theme: Microelectronics Packaging and Integration
Guest Editors: Babu R. Chalamala (Motorola, Inc.) and Robert H. Reuss (DARPA)
February 2003
Theme: Single-Event Upsets in Microelectronics
Guest Editors: Henry Tang (IBM T.J. Research Center) and Nils
Olsson (Uppsala University)
March 2003
Theme: Superhard Coating Materials
Guest Editors: Yip-Wah Chung (Northwestern University) and William
D. Sproul (Reactive Sputtering, Inc.)
April 2003
Theme: Cellular Solids
Guest Editors: Lorna J. Gibson (Massachusetts Institute of Technology)
May 2003
Theme: Photonic Materials for Optical Communications
Guest Editors: Hartmut Hillmer (University of Kassel) and Roland
Germann (IBM Research Division, Zurich Research Laboratory)
June 2003
Theme: Materials Science of Adhesives: How to
Bond Things Together
Guest Editors: Costantino Creton (ESPCI) and Eric Papon (Université
Bordeaux1)
August
2003
Theme: Advanced Fabrics
Guest Editors: Mary Lynn Realff (Georgia Institute of Technology)
and Heidi Schreuder-Gibson (U.S. Army Natick Soldier Center)
September
2003
Theme: Ultrahigh Temperature Materials for Jet
Engines
Guest Editors: J.-C. Zhao (GE Global Research Center) and Jack
H. Westbrook (Brookline Technologies)
October
2003
Theme: New Materials for Spintronics
Guest Editors: Young K. Yoo (Intematix Corporation) and Scott
A. Chambers (Pacific Northwest National Laboratory)
November
2003 Theme: Inkjet Printing of Functional Materials
Guest Editors: Henning Sirringhaus (University of Cambridge)
and Tatsuya Shimoda (Seiko-Epson Corporation, Japan)
December
2003 Theme: New Frontiers in the Application
of Neutron Scattering to Materials Science
Guest Editors: Dieter Richter (Forscungszentrum Julich) and J.
Michael Rowe (NIST)