Volume 27, No. 10 October 2002 Masthead
A Publication of the Materials Research Society [click for larger image] © Copyright 2002 Materials Research Society All rights reserved << Previous Issue | All Issues | Next Issue >> ADVANCES IN CHEMICAL­MECHANICAL PLANARIZATION Advances in Chemical­Mechanical Planarization, 743 R.K. Singh and R. Bajaj, Guest Editors [View Abstract] [View Full Article] Fundamentals of Slurry Design for CMP of Metal and Dielectric Materials, 752 R.K. Singh, S.-M. Lee, K.-S. Choi, G.B. Basim, W. Choi, Z. Chen, and B.M. Moudgil [View Abstract] [View Full Article (PDF) ] Nanotopography Issues in Shallow Trench Isolation CMP, 761 D. Boning and B. Lee [View Abstract] [View Full Article (PDF) ] Advances in Characterization of CMP Consumables, 766 M. Moinpour, A. Tregub, A. Oehler, and K. Cadien [View Abstract] [View Full Article (PDF) ] Development and Application of an Abrasive-Free Polishing Solution for Copper, 772 M. Hanazono, J. Amanokura, and Y. Kamigata [View Abstract] [View Full Article (PDF) ] Integration Challenges for CMP of Copper, 776 R. Bajaj, A. Zutshi, R. Surana, M. Naik, and T. Pan [View Abstract] [View Full Article (PDF) ] The Future of CMP, 779 D. Evans [View Abstract] [View Full Article (PDF) ] MRS Membership Approves New Constitution, 784 MRS Featured Volunteer, 784 Preview: 2002 MRS Fall Meeting, 786 MRS Superconductivity Workshop Explored Issues Related to Second-Generation YBCO-Coated Conductors, 812 Abstracts for November 2002 Journal of Materials Research, 717 Letter from the President, 733 On to Boston A. King Research/Researchers, 734 Science Policy. 740 U.S. House of Representatives Introduces Bill to Double DOE Funding Levels by FY07 J. Ouelette Resources 742 Advertisers in This Issue, 771 Upcoming Conferences, 814 Microscopy of Semiconducting Materials [View Full Article (PDF) ] Conference Reports, 814 Brazil-MRS [View Full Article (PDF) ] Library, 816 Metastable, Mechanically Alloyed and Nanocrystalline Materials, E. Ma, M. Atzmon, and C.C. Koch, Guest Eds., reviewed by R.W. Cahn Classified, 821		Buy this Issue Full Articles of this issue are available online to MRS Members in Acrobat PDF format If you are not yet a Member, you can join now by filling out the online Membership Application In This Issue • Classifieds • Advertisers • Resources • Reader Service Information Go To • Bulletin Home • Archives • Staff Contacts ON THE COVER: Advances in Chemical­Mechanical Planarization. (clockwise from upper left) Nanoporous silica particles of varying sizes and porosities synthesized by a modified sol-gel process; cross section of a device with seven layers of interconnections; and schematic diagram depicting microscale (top) and nanoscale (bottom) phenomena that occur during CMP. See the technical theme that begins on p. 743.

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