Low-Dielectric-Constant Materials for ULSI Interlayer-Dielectric Applications
W.W. Lee and P.S. Ho, Guest Editors

Vapor Deposition of Low-Dielectric-Constant Polymeric Thin Films
T-M. Lu and J.A. Moore

Organic and Inorganic Spin-On Polymers for Low-Dielectric-Constant Applications
N.P. Hacker

Nanoporous Silica as an Ultralow-k Dielectrics
C. Jin, J.D. Luttmer, D.M. Smith, and T.A. Ramos

Phase-Separated Inorganic-Organic Hybrids for Microelectronic Applications
R.D. Miller, J.L. Hedrick, D.Y. Yoon, R.F. Cook, and J.P.Hummel

Materials Issues and Characterization of Low-kMaterials for Submicron Interconnect Applications
E.T. Ryan, A.J. McKerrow, J. Leu, and P.S. Ho

Fluorinated Amorphous Carbon as a Low-Dielectric-Constant Interlayer Dielectric
K. Endo

Integration of Low-k Dielectric Materials into Sub-0.25-um Interconnects
R.S. List, A. Singh, A. Ralston, and G. Dixit

MRS NEWS

• 1997 MRS Fall Meeting Preview
  
• 1997 Von Hippel Award Goes to Gabor A. Somorjai for Broad Contributions to Surface Science
  
• Merton C. Flemings Selected for 1997 David Turnbull Lectureship for Contributions to Solidification Processing
  
• Shuji Nakamura Named 1997 MRS Medalist
  
• Plenary Speaker Harry Y. McSween Jr. to Address Materials Findings of the Mars Pathfinder
  

ABSTRACTS

Abstracts for December 1997 Journal of Materials Research

DEPARTMENTS

Material Matters
The Recent Revolution in High Performance Computing,
H.D. Simon

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