Volume 20, No. 11 November 1995
A Publication of the Materials Research Society
METALLIZATION FOR INTEGRATED CIRCUIT MANUFACTURING
- Metallization for Integrated Circuit Manufacturing, p. 33
R.V. Joshi, R.S. Blewer, and S. Murarka, Guest Editors - Chemical Vapor Deposition of TiN for Sub-0.5 um ULSI Circuits
M. Eizenberg - Collimated Sputtering of Titanium Nitride Films, p. 42
J.G. Ryan, S.B. Brodsky, T. Katata, M. Honda, N. Shoda, and H. Aochi - Chemical-Vapor-Deposited Tungsten for Vertical Wiring, p.
46
K. Kikuta - Aluminum-Based Metallurgy for Global Interconnects, p. 57
D. Pramnik - Chemical-Mechanical Planarization of Aluminum-Based Alloys
for Multilevel Metallization, p. 61
M.A. Fury, D.L. Scherber, and M.A. Stell - Simulations of Microstructure and Surface Profiles of Thin
Films for VLSI Metallization, p. 65
T. Smy, S.K. Dew, and M. J. Brett - Mechanical Stress in VLSI Interconnects: Origins, Effects,
Measurement, and Modeling, p. 70
P.A. Flinn - New Rapid Failure Analysis Techniques for Multilevel Metallization
E.I. Cole, Jr. and R.E. Anderson - The Reliability of Aluminum/Tungsten Technology for VLSI
Applications
Y. Shacham-Diamand
MRS NEWS
- Waler, Chair of the House Committee on Science, to Give Plenary Talk, p. 89
- Mullins Receives Von Hipple Award, p. 90
- De Fontaine Selected for Turnbull Lectureship, p. 91
- Materials Research Society Election Results for 1996, p. 91
- Capasso, Tromp Receive 1995 MRS Medals, p. 92
- Graduate Student Award Finalists - 1995 MRS Fall Meeting, p. 94
- New Symposium Tutorial Program Debuts at the 1995 MRS Fall Meeting, p. 98
- Subcommittee Reports on Special Projects, p. 100
ABSTRACTS
DEPARTMENTS
- Material Matters, p. 5
- Letters to the Editor, p. 8
- Research/Researchers, p. 11
- Washington News, p. 21
- Public Affairs Forum, p. 22
- Resources, p. 29
- Advertisers in this Issue, p. 56
- Historical Note, p. 101
- Calendar, p. 113
- Classified, p. 116
- Posterminaries, p. 120
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