Volume 19, No. 8 August 1994
A Publication of the Materials Research Society
COPPER METALLIZATION IN INDUSTRY
- Copper-Based Metallization in ULSI Structures, p. 15
J. Li, T.E. Seidel, and J.W. Mayer, Guest Editors - Materials Issues in Copper Interconnections, p. 23
J.M.E. Harper, E.G. Colgan, C-K. Hu, J.P. Hummel, L.P. Buchwalter, and C.E. Uzoh - Barriers Against Copper Diffusion into Silicon and Drift
Through Silicon Dioxide, p. 30
S-Q. Wang - Chemical Vapor Deposition of Copper for IC Metallization:
Precursor Chemistry and Molecular Structure, p. 41
P. Doppelt and T.H. Baum - Chemical Vapor Deposition of Copper for Advanced On-Chip
Interconnects, p. 49
A.V. Gelatos, A. Jain, R. Marsh, and C.J. Mogab - Electroless Copper Deposition on Metals and Metal Silicides,
p. 55
Cecilia Y. Mak - Planarized Copper Multilevel Interconnections for ULSI Applications,
p. 63
N. Misawa, T. Ohba, and H. Yagi - Copper Metallization Technology for Deep Submicron ULSIs,
p. 68
Y. Arita, N. Awaya, K. Ohno, and M. Sato - European Copper Interconnection Project, p. 75
J. Torres
INTERNATIONAL UNION OF MATERIALS RESEARCH SOCIETIES
- C-MRS and E-MRS to Hold Symposium on Electronic and Optoelectronic
Materials, p 76
MRS NEWS
- Courses About Internet and Federal Materials Research Programs Debut at 1994 MRS Fall Meeting, p. 77
- Nominations Being Accepted for MRS Outstanding Young Investigator Award, p. 77
- Call for Papers - 1995 MRS Spring Meeting, p. 78
DEPARTMENTS
- Research/Researchers, p. 4
- From Washington, p. 10
- Resources, p. 12
- Editor's Choice, p. 13
- Advertisers in this Issue, p. 54
- Upcoming Conferences, p. 81
- Education Exchange, p. 83
- Historical Note, p. 85
- Classified, p. 86
- Posterminaries, p. 87
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