Volume 18, No. 6 June 1993
A Publication of the Materials Research Society
COPPER METALLIZATION
- Copper-Based Metallization for ULSI Application, p. 18
J. Li, R.S. Blewer, and J.W. Mayer, Guest Editors - Chemical Vapor Deposition of Copper for Multilevel Metallization,
p. 22
A.E. Kaloyeros and M.A. Fury - Electroless Cu for VLSI, p. 31
J.S.H. Cho, H-K. Kang, S.S. Wong, and Y. Shacham-Diamond - Copper Etching: New Chemical Approaches, p. 39
M.J. Hampden-Smith and T.T. Kodas - Inlaid Copper Multilevel Interconnections Using Planarization
by Chemical-Mechanical Polishing, p. 46
S.P. Murarka, J. Steigerwald, and R.J. Gutmann - Refractory Metal Nitride Encapsulating for Copper Wiring,
p. 52
J. Li and J.W. Mayer
INTERNATIONAL UNION OF MATERIALS RESEARCH SOCIETIES
- Materials Research Society of India Hosts Fourth Annuals
General Meeting, p. 57
MRS 20TH ANNIVERSARY
- The Halfway Mark, p. 60
- MRS-Past and Future, p. 60
DEPARTMENTS
- Research/Researchers, p. 4
- From Washington, p. 13
- Editor's Choice, 16
- Resources, p. 17
- Section News, p. 59
- University Chapter News, p. 59
- Education Exchange, p. 62
- Historical Note, p. 64
- Advertisers in this Issue, p. 67
- Book reviews, p. 68
- Classified, p. 71
[Information from the Table of Contents may be reproduced]
