Volume 18, No. 12 December 1993
A Publication of the Materials Research Society
MATERIALS RELIABILITY IN MICROELECTRONICS
- Materials Reliability in Microelectronics, p. 16
J.R. Lloyd and C.V. Thompson, Guest Editors - Electromigration and IC Interconnects, p. 19
C.V. Thompson and J.R. Lloyd - Stress-Induced Void Formation in Metal Lines, p. 26
P.A. Flinn, A.S. Mack, P.R. Bresser, and T.N. Marieb - Physical Properties of SiO2 and Its Interface to Silicon
in Microelectronics Applications, p. 36
W. Weber and M. Brox - Long Wavelength Laser Diode Reliability and Lattice Imperfections,
p. 43
S.N.G. Chu - Reliability of Solder Joints, p. 49
D.R. Frear and F.G. Yost - Test Structures as a Way to Evaluate Packaging Reliability,
p. 55
D.W. Palmer
INTERNATIONAL UNION OF MATERIALS RESEARCH SOCIETIES
- ICAM'93 Sets New Mark, p. 59
- IUMRS Delegates Meet in Tokyo, p. 64
DEPARTMENTS
- Letter from the President, p. 3
- Material Matters, p. 5
- Research/Researchers, p. 8
- Resources, p. 13
- From Washington, p. 14
- Editor's Choice, p. 15
- Advertisers in this Issue, p. 54
- Historical Note, p. 66
- Education Exchange, p. 68
- Classified, p. 70
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