Thin films are widely used in optical, acoustic, electronic, magnetic, chemical, and mechanical devices. However, the performance of these devices is often limited by the mechanical properties of both the films and the structures to which they are attached. Stresses which arise during processing and service can lead to deformation and failure. Furthermore, thin films exhibit mechanical properties which are not simply predicted from the behavior of bulk materials. The purpose of this symposium is to provide a forum for discussion of recent developments in this field. Papers which elucidate macroscopic or microscopic phenomena from theoretical/experimental and technological/fundamental, viewpoints are solicited.
Topics of interest include:
* Scale effects in thin-film microstructure/mechanical property relations
* Origin, magnitude and distribution of "intrinsic" stresses in thin films
* Elastic, plastic and fracture toughness properties of thin films
* Thin-film decohesion -- interfacial modification effects
* Mechanical properties of compositionally modulated thin films, polymeric thin films, and thin surface layers made by implantation, oxidation, and other surface treatments
* Viscoelastic/viscoplastic dissipation in polymer or carbon-based thin films
* Tribological properties of thin films and surface layers
* Analytical and computer modeling of mechanical properties and mechanics of thin films and thin-film devices
* Testing and measurement techniques for obtaining mechanical properties of thin films
* Stress, strain, dislocations and mechanics in epitaxial layers
* Stress-driven mass transport processes in thin films; void and hillock formation
* Relationships between mechanical properties and electromigration failure processes
Tentative list of invited speakers: Ben Freund (Brown University); Scott Chambers (Pacific Northwest Laboratory); Tsai-Wei Wu (IBM Almaden Research Center); William Nix (Stanford University); Trevor Page (Newcastle); and Terry Michalske (Sandia National Laboratories)
Yes, Tell Me How To Submit an Abstract
Symposium Organizers
William W. Gerberich
University of Minnesota
151 Amundson Hall
421 Washington Avenue, SE
Minneapolis, MN 55455
Phone (612) 625-8548
Fax (612) 626-7246
wgerb@maroon.tc.umn.edu
Huajian Gao
Division of Applied Mechanics
Stanford University
265 Durand
Stanford, CA 94305-4040
Phone (415) 725-2560
Fax (415) 723-1778
gao@am-sun2.stanford.edu
Jan-Eric Sundgren
Thin Film Physics Division
Linköping University
S-581 83 Linköping
Sweden
Phone (46) 13-281277
Fax (46) 13-137586
jes@ifm.liv.se
Shefford P. Baker
Max-Planck-Institut für
Metallforschung
Seestraße 92
70174 Stuttgart
Germany
Phone (49) 711-2095-242
Fax (49) 711-2095-250
baker@vaxwwl.mpi-stuttgart.mpg.de
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