Symposium Support
*Hysitron, Inc.
*WITec GmbH

*Spring Exhibitor

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Proceedings to be published online
(see ONLINE PUBLICATIONS at www.mrs.org)
as volume 875E
of the Materials Research Society
Symposium Proceedings Series.
This volume may be published in print format after the meeting.

SESSION O1: Elasticity in Thin Films
Chair: Kazuki Takashima
Tuesday Morning, March 29, 2005
Room 2022 (Moscone West)
8:30 AM *O1.1
Advanced Resonant-Ultrasound Spectroscopy for Studying Anisotropic Elastic Constants of Thin Films. Hirotsugu Ogi, Graduate School of Engineering Scinece, Osaka University, Osaka, Japan.

9:00 AM O1.2
Elastic Constants and Incohesive Grain Bonds of Nanocrystalline CVD-Diamond Thin Films: Resonant Ultrasound Spectroscopy and Micromechanics Calculation. Hirotsugu Ogi¹, Nobutomo Nakamura¹, Hiroshi Tanei¹, Ryuji Ikeda^2,3, Takemoto Mikio³ and Masahiko Hirao¹; ¹Graduate School of Engineering Scinece, Osaka University, Osaka, Japan; ²Asahi Diamond Ind Co Ltd, Chiba, Japan; ³Mechanical Engineering, Aoyama Gakuin University, Kanagawa, Japan.

9:15 AM O1.3
Mechanical Properties and Size Effect in Nanometric W/Cu Multilayers. Pascale Villain, Damien Faurie, Pierre-Olivier Renault, Eric Le Bourhis, Philippe Goudeau and Frederic Badawi; LMP, SP2MI, University of Poitiers - CNRS, Futuroscope Chasseneuil, France.

9:30 AM O1.4
Elasticity and Coalescence in Thin Metallic Films. Nail R. Chamsoutdinov and Amarante Bottger; Materials Science, TU Delft, Delft, Netherlands.

9:45 AM O1.5
Improvement of the Elastic Modulus of Micromachined Structures Using Carbon Nanotubes. Nicolas Duarte¹, Prasoon Joshi¹, Abhijat Goyal¹, Paul Sunal², Awnish Gupta³, Srinivas Tadigadapa¹ and Peter Ecklund³; ¹Electrical Engineering, The Pennsylvania State University, University Park, Pennsylvania; ²Engineering Science and Mechanics, The Pennsylvania State University, University Park, Pennsylvania; ³Physics, The Pennsylvania State University, University Park, Pennsylvania.

10:00 AM BREAK

SESSION O2: Characterizing Thin Films by Nanoindentation
Chair: Andrew Minor
Tuesday Morning, March 29, 2005
Room 2022 (Moscone West)
10:30 AM *O2.1
Nanoindentation and Raman Microspectroscopy Study of Semiconductors and Ceramics. Yury Gogotsi, Department of Materials Science and Engineering, Drexel University, Philadelphia, Pennsylvania.

11:00 AM O2.2
Application of Depth-Sensing Macro/Nano Indentation and Micro-FTIR Spectroscopy for Understanding the Weathering Performance of a Coated Engineering Thermoplastic Blend. Samik Gupta¹, Jan Lohmeijer², Savio Sebastian¹, Nisha Preschilla¹ and Amit Biswas¹; ¹Polymers and Synthetic materials, GE India Technology Centre, Bangalore, KARNATAKA, India; ²Advanced Materials, GE, BOZ, Netherlands.

11:15 AM O2.3
Mechanical Characterization of Multilayer Thin Film Stacks Containing Porous Silica Using Nanoindentaion and the Finite Element Method. Ke Li¹, Raghu Mudhivarthi^2,3, Roja Gottimukkala^2,3, Sunil Saigal¹ and Ashok Kumar^2,3; ¹Department of Civil & Environmental Engineering, University of South Florida, Tampa, Florida; ²Department of Mechanical Engineering, University of South Florida, Tampa, Florida; ³Nanomaterials and Nanomaunfacturing Research Center, University of South Florida, Tampa, Florida.

11:30 AM O2.4
Model for the Indentation Size Effect Taking into Account Nanoindenter Tip Bluntness. Ju-Young Kim¹, David T. Read² and Dongil Kwon¹; ¹School of Materials Science and Engineering, Seoul National University, Seoul, South Korea; ²Materials Reliability Division, National Institute of Standards and Technology, Boulder, Colorado.

11:45 AM O2.5
Characterizing Viscoelastic Behavior Using Nanoindentation. Mark R. VanLandingham¹, Thomas F. Juliano¹ and Peter L. Drzal²; ¹Materials Division, U. S. Army Research Laboratory, Aberdeen Proving Ground, Maryland; ²Building and Fire Research Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland.

SESSION O3/BB2: Joint Session: Mechanical Behavior of Nanostructured Films
Chairs: Peter Anderson and Erica Lilleodden
Tuesday Afternoon, March 29, 2005
Room 2016 (Moscone West)
1:30 PM *O3.1/BB2.1
Plastic Strength Maps for Metallic Multilayer Thin Films. Peter M. Anderson, Dept of Materials Science and Engineeering, Ohio State University, Columbus, Ohio.

2:00 PM O3.2/BB2.2
Atomic-Scale Analysis of Strain Relaxation Mechanisms in Ultra-Thin Metallic Films. M. Rauf Gungor and Dimitrios Maroudas; Department of Chemical Engineering, University of Massachusetts, Amherst, Amherst, Massachusetts.

2:15 PM O3.3/BB2.3
Deformation Mechanisms During Nanoindentation of Ultrafine and Nanocrystalline Metals. Miao Jin¹, Andrew M. Minor², Daibin Ge², Eric A. Stach³ and J. W. Morris, Jr.¹; ¹Department of Materials Science and Engineering, University of California, Berkeley, Berkeley, California; ²National Center for Electron Microscopy, Lawrence Berkeley National Laboratory, Berkeley, California; ³School of Materials Engineering, Purdue University, West Lafayette, Indiana.

2:30 PM O3.4/BB2.4
In-Situ Peak Profile Analysis of Submicron Aluminum Thin Films in Tension. D. S. Gianola¹, S. Brandstetter², K. J. Hemker¹, A. Cervellino² and H. Van Swygenhoven²; ¹Mechanical Engineering, Johns Hopkins University, Baltimore, Maryland; ²Paul Scherrer Institute, Villigen, CH-5232, Switzerland.

2:45 PM O3.5/BB2.5
Behavior of Individual Grains in Nanocrystalline Ni During Deformation. Zhiwei Shan¹, Eric Stach², James Knapp³, David Follstaedt³, Jorg Wiezorek⁴ and Scott Mao¹; ¹Mechanical Engineering, University of Pittsburgh, Pittsburgh, Pennsylvania; ²National Center for Electron Microscopy, Lawrence Berkeley National Laboratory, Berkeley, California; ³The Physical, Chemical and Biomolecular Sciences Center, Sandia National Laboratories, Albuquerque, New Mexico; ⁴Materials Science and Engineering, University of Pittsburgh, Pittsburgh, Pennsylvania.

3:00 PM BREAK

3:30 PM O3.6/BB2.6
Grain Agglomeration in Nanocrystalline Ni. Zhiwei Shan¹, David Follstaedt², James Knapp², Eric Stach³, Jorg Wiezorek⁴ and Scott Mao¹; ¹Mechanical Engineering, University of Pittsburgh, Pittsburgh, Pennsylvania; ²Physical and Chemical Science Center, Sandia National Laboratories, Albuquerque, New Mexico; ³School of Materials Engineering, Purdue University, West Lafayette, Indiana; ⁴Materials Science and Engineering, University of Pittsburgh, Pittsburgh, Pennsylvania.

3:45 PM O3.7/BB2.7
Characterization and Mechanical Behavior of Cu/Cu Nano-Laminates. Andrea Maria Hodge^1,2, Y. Morris Wang^1,2 and Troy W. Barbee Jr.¹; ¹Chemistry and Materials Science, LLNL, Livermore, California; ²Nanoscale Synthesis and Characterization Laboratory, LLNL, Livermore, California.

4:00 PM O3.8/BB2.8
Mechanical Properties and Deformation Under Nanoindents in Metal/Nitride Nanoscale Multilayers. Gregory Abadias¹, Yau-Yau Tse¹, Anny Michel¹, Christophe Tromas¹ and Sergey N. Dub²; ¹Laboratoire de Metallurgie Physique, UMR 6630, Universite de Poitiers, Futuroscope-Chasseneuil, France; ²Institute of Superhard Materials, Kiev, Ukraine.

4:15 PM O3.9/BB2.9
Thermal Plasma Chemical Vapor Deposition of Superhard Nanocrystalline Silicon Carbide Films. Steven L. Girshick¹, Feng Liao¹, William M. Mook², Michael R. Zachariah³ and William W. Gerberich²; ¹Mechanical Engineering, University of Minnesota, Minneapolis, Minnesota; ²Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, Minnesota; ³Mechanical Engineering, University of Maryland, Minneapolis, Maryland.

4:30 PM O3.10/BB2.10
Thermal Plasma Chemical Vapor Deposition of Superhard Nanostructured Si-C-N Coatings. Nicole J. Wagner¹, Megan Cordill², Lenka Zajickova¹, Joachim V. R. Heberlein¹ and William W. Gerberich²; ¹Mechanical Engineering, University of Minnesota, Minneapolis, Minnesota; ²Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, Minnesota.

4:45 PM O3.11/BB2.11
Depth Profiling of Mechanical Properties on the Nanoscale of Single Layer and Stepwise Graded DLC Films by Nanoindentation and AFM. Carlos Ziebert, Sven Ulrich, Michael Stueber and Helmut Holleck; Institut fuer Materialforschung I, Forschungszentrum Karlsruhe, Karlsruhe, Germany.

SESSION O4: Poster Session: Mechanical Properties of Thin Films - Testing and Analysis
Chairs: Thomas Buchheit, Andrew Minor, Ralph Spolenak and Kazuki Takashima
Tuesday Evening, March 29, 2005
8:00 PM
Salons 8-15 (Marriott)
O4.1
Experiments on the Elastic Size Dependence of LPCVD Silicon Nitride. Yuxing Ren and David C. C. Lam; Mechanical Engineering, HKUST, Hong Kong, China.

O4.2
Correction of Film Thickness Measurement Using Numerical Simulation and Semi-Empirical Models of Indentation. Hamed Lakrout¹ and Greg F. Meyers²; ¹Materials Research, The Dow Chemical Company, Midland, Michigan; ²Analytical Sciences, The Dow Chemical Company, Midland, Michigan.

O4.3
Evolution of Wrinkles in a Compressed Elastic Film on a Viscoelastic Layer. Rui Huang and Se Hyuk Im; Department of Aerospace Engineering and Engineering Mechanics, University of Texas, Austin, Texas.

O4.4
Effect of Residual Stress on Nanoindentation Behavior of Materials. Zhi-Hui Xu and Xiaodong Li; Department of Mechanical Engineering, University of South Carolina, Columbia, South Carolina.

O4.5
Thermomechanical Behavior and Properties of Passivated PVD and ECD Cu Thin Films. M. Gregoire¹, S. Kordic², P. Gergaud³, O. Thomas³ and M. Ignat⁴; ¹STMicroelectronics, Crolles2 Alliance, Crolles, France; ²Philips Semiconductors, Crolles 2 Alliance, Crolles, France; ³University of Aix-Marseille III, TECSEN-UMR CNRS, Marseille, France; ⁴Institut National Polytechnique of Grenoble, LTPCM-UMR CNRS, Saint Martin d'Heres, France.

O4.6
A Model for Curvature in Epitaxially-Grown Heterostructures. Ganesh Vanamu¹, Tariq A. Khraishi² and Abhaya K. Datye¹; ¹Chemical and Nuclear, University of New Mexico, Albuquerque, New Mexico; ²Mechanical Engineering Department, University of New Mexico, Albuquerque, New Mexico.

O4.7
Investigation of Thin Film Elastic Properties by in situ Tensile Testing in a X-Ray Diffractometer. Damien Faurie, Pierre-Olivier Renault, Eric Le Bourhis and Philippe Goudeau; Laboratoire de Metallurgie Physique, Universite de Poitiers, Futuroscope-chasseneuil, France.

O4.8
A Microtensile Set Up for Characterising the Mechanical Properties of Thin Films. Brigita Cyziute¹, Liudvikas Augulis¹, Joel Bonneville², Philippe Goudeau², Sigitas Tamulevicius¹ and Claude Templier²; ¹Physics, Kaunas University of Technology, Kaunas, Lithuania; ²Physics, University of Poitiers, Futuroscope Chasseneuil, France.

O4.9
Characterization of Stress Relaxation, Dislocations and Crystallographic Tilt via X-ray Microdiffraction in GaN(0001) Layers Grown by Maskless Pendeo-Epitaxy. Rozaliya I. Barabash¹, Gene E. Ice¹, Wenjun Liu¹, Sven Einfeldt², Detlef Hommel², Amy M. Roskowski³ and Robert F. Davis³; ¹Metals and Ceramics Div., Oak Ridge National Laboratory, Oak Ridge, Tennessee; ²Institute of Solid State Physics, University of Bremen, Bremen, Germany; ³Department of Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina.

O4.10
High-Cycle Fatigue Testing of Micro/nano-Scale Silicon Nitride Thin Films Using a Novel Mechanical-Amplifier Actuator. Wen-Hsien Chuang¹, Rainer K. Fettig² and Reza Ghodssi¹; ¹Electrical and Computer Engineering, University of Maryland at College Park, College Park, Maryland; ²NASA Goddard Space Flight Center, Greenbelt, Maryland.

O4.11
Mechanical and Structural Characterization by X-ray Diffraction in Suspended Bilayer Structure for MEMS Applications. Philippe Goudeau¹, Nobumichi Tamura², Sebastien Rigo³, Talal Masri³, Jacques-Alain Petit³ and Jean-Michel Desmarres⁴; ¹LMP, SP2MI, University of Poitiers - CNRS, Futuroscope Chasseneuil, France; ²ALS, Lawrence Berkeley National Laboratory, Berkeley, California; ³ENIT, Tarbes, France; ⁴CNES, Toulouse, France.

O4.12
Mechanical Properties of a-SiC:H Films Grown by PECVD Using 1,3-Disilabutane. Young Kuk Lee and Yunsoo Kim; Korea Research Institute of Chemical Technology, Taejon, South Korea.

O4.13
Stress Analysis of Strained Superlattices. Halyna M. Khlyap^1,2 and Roman Peleshchak²; ¹Physics, University of Technology, Kaiserslautern, Germany; ²Physics, State Pedagogical University, Drohobych, Ukraine.

O4.14
Experimentally and Theoretically Investigations of the Magnetic Phases of Epitaxially Grown EuSe at Low Fields and Temperatures. Klemens Rumpf¹, Petra Granitzer¹, Walter Soellinger², Wolfgang Heiss² and Heinz Krenn¹; ¹Institute of Experimental Physics, University of Graz, Graz, Austria; ²Institute of Semiconductor and Solid State Physics, University of Linz, Linz, Austria.

O4.15
Observation of Micro-Tensile Behavior of Thin Film TiN and Au Using ESPI Technique. Yong-Hak Huh¹, Dong-Iel Kim², Jun-Hee Hahn¹, Gwang-Seok Kim¹, Chang-Doo Kee², Soon-Chang Yeon³ and Yong Hyub Kim³; ¹Center for Env. and Safety Measurment, KRISS, Daejon, South Korea; ²Department of Mechanical Engineering, Chonnam National University, Kwangjoo, South Korea; ³School of Mechanical and Aerospace Engineering, Seoul National University, Seoul, South Korea.

O4.16
Investigation of Viscoelastic Properties of Thin Films via Base-Vibrating Cantilever Beams. Tobias Hoechbauer¹, Yun-Che Wang¹, John Greg Swadener¹, Tim Darling², Richard Hoagland¹, Xinghang Zhang¹ and Amit Misra¹; ¹MST-8, Los Alamos National Laboratory, Los Alamos, New Mexico; ²MST-10, Los Alamos National Laboratory, Los Alamos, New Mexico.

O4.17
High Cycle Fatigue Damage in Thin Cu Films. Dong Wang, Cynthia A. Volkert and Oliver Kraft; Forschungszentrum Karlsruhe, Karlsruhe, Germany.

O4.18
Analysis of Film Residual Stress on a of 4-Point Bend Test for Thin Film Adhesion. Sassan Roham and Timothy K. Hight; Mechanical Engineering, Santa Clara University, Santa Clara, California.

O4.19
Practical Work of Adhesion of Polymer Coatings Studied by Laser Induced Delamination. Alexander Fedorov, Jeff Th. M. DeHosson, Redmer van Tijum and Willem P. Vellinga; Applied Physics, Materials Science Centre and the Netherlands Institute for Metals Research, University of Groningen, Groningen, Netherlands.

O4.20
Stress Characterization and Crack Evolution of Mo Thin Film Deposited on the Large Area Glass in the TFT LCD Process. Yang H. Bae, Chang-Oh Jeong, Je Hun Lee, Beomseok Cho, Shiyul Kim and Soonkwon Lim; Process Development Team, Samsung Electronics Corp., Yongin-City, Gyeounggi-Do, South Korea.

O4.21
Strain Relaxation in Si_1-xGe_x Thin Films on Si (100) Substrates: Modeling and Comparisons with Experiments. Kedarnath Kolluri¹, Luis A. Zepeda-Ruiz², Cheruvu S. Murthy³ and Dimitrios Maroudas¹; ¹Chemical Engineering, University of Massachusetts, Amherst, Massachusetts; ²Chemistry and Material Sciences Directorate, Lawrence Livermore National Laboratory, Livermore, California; ³IBM Semiconductor Research and Development Center, Hopewell Junction, New York.

O4.22
Comparison Between In-situ Annealing and External Annealing For Barium Ferrite Thin Films Made by RF Magnetron Sputtering. Alaaedeen Abuzir and W. J. Yeh; Physics, University of Idaho, Moscow, Idaho.

O4.23
Correlation Between Elastic Constants and Magnetic Anisotropy in Co/Pt Superlattice Thin Films. Nobutomo Nakamura¹, Hirotsugu Ogi¹, Teruo Ono², Masahiko Hirao¹, Takeshi Yasui¹ and Osamu Matsuda³; ¹Graduate School of Engineering Science, Osaka University, Toyonaka, Osaka, Japan; ²Institute for Chemical Research, Kyoto University, Uji, Kyoto, Japan; ³Faculty of Engineering, Hokkaido University, Sapporo, Hokkaido, Japan.

SESSION O5: Thin Film Plasticity- Size Effects
Chair: Ralph Spolenak
Wednesday Morning, March 30, 2005
Room 2022 (Moscone West)
8:30 AM O5.1
Investigating Size Effects in Metals Using Microcompression Tests. Cynthia A. Volkert, Forschungszentrum Karlsruhe, Karlsruhe, Germany.

8:45 AM O5.2
The Evolution and Relaxation of Thermal Stress in Thin Gold Films. Linda Sauter¹, T. John Balk², Gerhard Dehm¹ and Eduard Arzt^1,3; ¹Max-Planck-Institute for Metals Research, Stuttgart, Germany; ²Department of Chemical and Materials Engineering, University of Kentucky, Lexington, Kentucky; ³Institut fuer Metallkunde, Universitaet Stuttgart, Stuttgart, Germany.

9:00 AM O5.3
Plasticity and Interfacial Crack Growth in Thin Gold Films. Megan Cordill¹, Neville Moody², David Adams³, David Bahr⁴, Alex Volinsky⁵ and William Gerberich¹; ¹University of Minnesota, Minneapolis, Minnesota; ²Sandia National Laboratories, Livermore, California; ³Sandia National Laboratories, Albuquerque, New Mexico; ⁴Washington State University, Pullman, Washington; ⁵University of South Florida, Tampa, Florida.

9:15 AM O5.4
Plasticity of Passivated and Unpassivated Ultra Thin Cu Films Measured by an in-situ Synchrotron Technique. Patric Gruber¹, Jochen Boehm¹, Linda Sauter², Ralph Spolenak³, Alexander Wanner⁴ and Eduard Arzt^1,2; ¹Institut fuer Metallkunde, Universitaet Stuttgart, Stuttgart, Germany; ²Max-Planck-Institut fuer Metallkunde, Stuttgart, Germany; ³Labor fuer Nanometallurgie, ETH Zuerich, Zuerich, Switzerland; ⁴Institut fuer Werkstoffkunde I, Universitaet Karlsruhe, Karlsruhe, Germany.

9:30 AM O5.5
How Stretchable Can We Make Thin Metal Films? Candice Tsay¹, Stephanie P. Lacour¹, Sigurd Wagner¹, Teng Li² and Zhigang Suo²; ¹Department of Electrical Engineering, Princeton University, Princeton, New Jersey; ²Division of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts.

9:45 AM O5.6
An Investigation of Film Thickness on Mechanical Properties of Face Centered Cubic Thin Films on Silicon Substrates. Yifang Cao¹, Zong Zong¹, Derek Nankivil², Seyed Allameh¹, and Wole Soboyejo¹; ¹Princeton Institute of Materials Sciences and Engineering (PRISM); Department of Mechanical and Aerospace Engineering, Princeton University, Princeton, New Jersey; ²Department of Mechanical, Materials, and Aerospace Engineering, University of Central Florida, Orlando, Florida.

10:00 AM BREAK

SESSION O6: Thin Film Plasticity- Creep
Chair: Marc Legros
Wednesday Morning, March 30, 2005
Room 2022 (Moscone West)

10:30 AM O6.1
Evolution of Stress-Induced Hillocks in Pure Al Films and Lines on Glass Substrate. Young-Chang Joo and Soo-Jung Hwang; Materials Sci. & Eng., Seoul National University, Seoul, South Korea.

10:45 AM O6.2
ABSTRACT WITHDRAWN

11:00 AM O6.3
Microtensile Testing of Gold and Gold-Vanadium Thin Films at Elevated Temperatures. Ming-Tzer Lin², Paul El-Deiry³, Richard Chromik⁴, Nicholas Barbosa³, Walter Brown³, Terry J. Delph¹ and Richard Vinci³; ¹Department of Mechanical Engineering & Mechanics, Lehigh University, Bethlehem, Pennsylvania; ²Institute of Precision Engineering, National Chung Hsing University, Taichung, Taiwan; ³Dept. of Materials Science and Engineering, Lehigh University, Bethlehem, Pennsylvania; ⁴Naval Research Laboratory, Washington, District of Columbia.

11:15 AM O6.4
Characterization of Structural and Mechanical Properties of NiTi Shape Memory Thin Films for Micro Actuators. David Getchel and Richard Norman Savage; Materials Engineering, Cal Poly State University, San Luis Obispo, California.

11:30 AM O6.5
Influence of Gas Atmosphere on Thin Metal Film Plasticity. Thomas Wuebben, Gerhard Dehm and Eduard Arzt; Arzt, Max-Planck-Institute for Metals Research, Stuttgart, Germany.

11:45 AM O6.6
Laser Lateral Crystallization of Thin Metallic Films on SiO₂. James E. Kline and John P. Leonard; Materials Science and Engineering, University of Pittsburgh, Pittsburgh, Pennsylvania.

SESSION O7: Thin Film Plasticity- Modeling
Chair: Thomas Buchheit
Wednesday Afternoon, March 30, 2005
Room 2022 (Moscone West)
1:30 PM O7.1
Discrete Dislocation Study of Freestanding Thin Films. Lucia Nicola^1,2, Erik Van der Giessen¹ and Alan Needleman²; ¹Materials Science Center, University of Groningen, Groningen, Netherlands; ²Division of Engineering, Brown University, Providence, Rhode Island.

1:45 PM O7.2
Direct Dislocation Dynamics Simulation of Annihilation Radius in Thin Films. Meijie Tang, Lawrence Livermore National Lab., Livermore, California.

2:00 PM O7.3
ABSTRACT WITHDRAWN

2:15 PM O7.4
Dislocation Evolution in Thin Film-Substrate Heterostructures. Lizhi Sun and E. H. Tan; University of Iowa, Iowa City, Iowa.

2:30 PM *O7.5
Deposition and Characterization of Ti-Ni-Pd and Ti-Ni-Pt Shape Memory Alloy Thin Films. Greg P. Carman, Daniel Shin and K. P. Mohanchandra; MAE, UCLA, Los Angeles, California.

3:00 PM BREAK

SESSION O8: Novel Testing Techniques
Chair: Thomas Buchheit
Wednesday Afternoon, March 30, 2005
Room 2022 (Moscone West)
3:30 PM O8.1
Effects of Specimen Alignment on the Mechanical Properties of Polysilicon Film. Shin-Woo Kim¹, Chung-Seog Oh¹ and Hak-Joo Lee²; ¹Mechanical Engineering, Kumoh National Institute of Technology, Gumi-si, Gyeongbuk, South Korea; ²Structural Research, Korea Institute of Machinery and Materials, Daejeon-si, South Korea.

3:45 PM O8.2
Thermal Expansion of Low Dielectric Constant Thin Films by High-Resolution X-ray Reflectivity. Kazuhiko Omote, Rigaku Corporation, Akishima, Tokyo, Japan.

4:00 PM O8.3
Investigation of Local Stress Fields: Finite Element Modelling and High Resolution X-Ray Diffraction. Audrey Loubens^1,2, Christian Rivero^1,3, Philippe Boivin³, Barbara Charlet⁴, Roland Fortunier² and Olivier Thomas¹; ¹TECSEN UMR 6122, Marseille, France; ²Ecole Nationale Superieure des Mines de Saint Etienne CMP Georges Charpak, Gardanne, France; ³ST Microelectronics, Rousset, France; ⁴CEA Leti, Grenoble, France.

4:15 PM O8.4
Determining Forces of Self-Assembly in Thin Films by Measuring Thermal Vibrations. Konrad Thuermer and Norman Bartelt; Sandia National Laboratories (CA), Livermore, California.

4:30 PM *O8.5
Using the Electron Microscope to Explore Reliability in Nanostructured Materials. Eric A. Stach^1,2, D. Ge², A. Minor², J. W. Morris³, V. Gopal¹ and V. Radmilovic¹; ¹School of Materials Engineering, Purdue University, West Lafayette, Indiana; ²National Center for Electron Microscopy and Materials Science Division, Lawrence Berkeley National Laboratory, Berkeley, California; ³Department of Materials Science and Engineering, University of California, Berkeley, California; ⁴Department of Materials Science and Engineering, Pennsylvania State University, College Station, Pennsylvania.

SESSION O9: In-Situ Characterization Techniques
Chair: Andrew Minor
Thursday Morning, March 31, 2005
Room 2022 (Moscone West)
8:30 AM *O9.1
In-Situ TEM Study of Plastic Stress Relaxation Mechanisms in Metallic Films. Marc Legros¹, Gerhard Dehm², T. John Balk³ and Eduard Arzt²; ¹CEMES-CNRS, Toulouse, France; ²Max-Planck-Institut fuer Metallforschung, Stuttgart, Germany; ³Chemical and Materials Engineering, University of Kentucky, Lexington, Kentucky.

9:00 AM O9.2
In-situ Stress Characterization in MEMS Thin Suspended Metallic Membrane. Wei Wei¹, Mark Bachman² and Guann-Pyng Li³; ¹Integrated Nanosystem Research Facility, ChEMS, UC, Irvine, Irvine, California; ²Integrated Nanosystem Research Facility, EECS, UC, Irvine, Irvine, California; ³Integrated Nanosytem Research Facility, EECS, UC, Irvine, Irvine, California.

9:15 AM O9.3
Nanometrology of Multilayer Polymer Thin Films. Christopher M. Stafford, Shu Guo and Martin Y. M. Chiang; Polymers Division, National Institute of Standards and Technology, Gaithersburg, Maryland.

9:30 AM O9.4
Fiber-Optics Low-Coherence Integrated Metrology for in-situ Non-Contact Characterization of Novel Materials and Structures. Wojciech J. Walecki, Alexander Pravdivtsev, Manuel Santos, Kevin Lai, S. H. Lau and Ann Koo; FSM, San Jose, California.

9:45 AM BREAK

SESSION O10: Adhesion and Fracture of Thin Films
Chair: Kazuki Takashima
Thursday Morning, March 31, 2005
Room 2022 (Moscone West)
10:15 AM *O10.1
Quantitative Evaluation of Interface Adhesion Strength in Multilayer Films by Nanoscratch Test. Junichi Koike and Atsuko Sekiguchi; Dept. Materials Science, Tohoku University, Sendai, Japan.

10:45 AM O10.2
Adhesion on Metal-Polymer Interfaces During Uniaxial Plastic Deformation. R. van Tijum^1,2,3, W. P. Vellinga^1,2,3 and J. Th. M. DeHosson^1,2,3; ¹Applied Physics, University of Groningen, Groningen, Netherlands; ²Materials Science Centre, Groningen, Netherlands; ³Netherlands Institute for Metals Research, Delft, Netherlands.

11:00 AM O10.3
In-situ Observations of Cracks Propagating Along Interfaces Between Metals and Thin Polymer Films. W. P. Vellinga^1,2, R. van Tijum^1,2 and J. Th. M. De Hosson^1,2; ¹Materials Science, Applied Physics, University of Groningen, Groningen, Netherlands; ²Netherlands Institute of Metals Research, Delft, Netherlands.

11:15 AM O10.4
Macro Stress Mapping on Thin Film Buckling. Philippe Goudeau¹, Nobumichi Tamura², Guillaume Parry¹, Jerome Colin¹, Christophe Coupeau¹ and Howard A. Padmore²; ¹LMP, SP2MI, University of Poitiers - CNRS, Futuroscope Chasseneuil, France; ²ALS, Lawrence Berkeley National Laboratory, Berkeley, California.

11:30 AM O10.5
Interfacial Properties of Pure-Silica-Zeolite Low-k Thin Films. Lili Hu¹, Zijian Li², Yushan Yan² and Junlan Wang¹; ¹Mechanical Engineering, University of California, Riverside, California; ²Chemical and Environmental Engineering, University of California, Riverside, California.

11:45 AM O10.6
Environmental Effects on Crack Characteristics for OSG Materials. Jeannette M. Jacques, Ting Y. Tsui, Andrew J. McKerrow and Robert Kraft; Silicon Technology Development, Texas Instruments, Inc., Dallas, Texas.

SESSION O11/B7: Joint Session: Fatigue and Stress in Interconnect Metallization
Chairs: Paul Besser and Ralph Spolenak
Thursday Afternoon, March 31, 2005
Room 2004 (Moscone West)
1:30 PM *O11.1/B7.1
Thermal Fatigue in Cu Films. Cynthia A. Volkert^1,2, Reiner Moenig^1,2, Erica Lilleodden^1,2, Young Bae Park^3,2 and Guang Ping Zhang^4,2; ¹Forschungszentrum Karlsruhe, Karlsruhe, Germany; ²Max-Planck-Institut fuer Metallforschung, Stuttgart, Germany; ³Andong National University, Andong, South Korea; ⁴Shenyang National Laboratory for Materials Science, Shenyang, China.

2:00 PM O11.2/B7.2
TEM-Based Analysis of Defects Induced by AC Thermomechanical versus Microtensile Deformation in Aluminum Thin Films. Roy H. Geiss, Robert R. Keller, David T. Read and Yi-Wen Cheng; Materials Reliability, NIST, Boulder, Colorado.

2:15 PM O11.3/B7.3
Employing Thin Film Failure to Form Templates for Nano-Electronics. Rainer Adelung, Mady Elbahri, Shiva Kuma Rudra, Abhijit Biswas, Sahid Jebril, Rainer Kunz, Sebastian Wille and Michael Scharnberg; Materials Science, CAU Kiel, Kiel, Germany.

2:30 PM O11.4/B7.4
Degradation of Fracture and Fatigue Properties of MEMS Structures Under Cyclic Loading. Jong-jin Kim and Dongil Kwon; School of Materials Science and Engineering, Seoul National University, Seoul, South Korea.

2:45 PM O11.5/B7.5
Electrical and Mechanical Reliability of Cu Alloy Thin Film for Future Technology Node. Seol-Min Yi¹, Jeong-Uk An¹, Yong-Hak Huh², Young-Bae Park³ and Young-Chang Joo¹; ¹School of Materials Science and Engineering, Seoul National University, Seoul, South Korea; ²Strength Evaluation Group, Korea Research Institute of Standards and Science, Deajeon, South Korea; ³School of Materials Science & Engineering, Andong National University, Andong-si, Kyungsangbukdo, South Korea.

3:00 PM BREAK

3:30 PM *O11.6/B7.6
Effect of Microstructure and Dielectric Materials on Stress-Induced Damages in Damascene Cu/Low-K Interconnects. Young-Chang Joo and Jong-Min Paik; Materials Sci. & Eng., Seoul National University, Seoul, South Korea.

4:00 PM O11.7/B7.7
Comparison of Line Stress Predictions with Measured Electromigration Failure Times. Rao R. Morusupalli¹, William D. Nix¹, Jamshed R. Patel^1,2 and Arief S. Budiman¹; ¹Materials Science and Engineering, Stanford University, Stanford, California; ²Advanced Light Source (ALS), Lawrence Berkeley National Laboratory (LBNL), Berkeley, California.

4:15 PM O11.8/B7.9
Stress-Induced Void Formation in Passivated Cu Film During Thermal Cycling and Isothermal Annealing. Dongwen Gan, Bin Li and Paul S. Ho; Laboratory for Interconnect and Packaging, University of Texas at Austin, Austin, Texas.

4:30 PM O11.9/B7.9
Stress Generation in PECVD SiN Thin Films for Microelectronics Applications. Michael Belyansky¹, Nancy Klymko¹, Anita Madan¹, Anu Mallikarjunan¹, Ying Li¹, Ashima Chakravarti¹, Sadanand Deshpande¹, Anthony Domenicucci¹, Stephen Bedell¹, Edward Adams¹ and Sey-Ping Sun²; ¹IBM Microelectronics, Hopewell Junction, New York; ²Advanced Micro Devices, Hopewell Junction, New York.

SESSION O12: Poster Session: Deformation, Growth and Microstructure in Thin Films
Chairs: Thomas Buchheit, Andrew Minor, Ralph Spolenak and Kazuki Takashima
Thursday Evening, March 31, 2005
8:00 PM
Salons 8-15 (Marriott)

O12.1
Dislocation Sources and Their Effect in the Initiation of Plasticity at Shallow Indentation Depths. Suman Vadlakonda and Mirshams Reza; University of North Texas, Denton, Texas.

O12.2
The Effect of Microstructural Inhomogeneity on Grain Boundary Diffusion Creep. Dorel Moldovan and Kanishk Rastogi; Mechanical Engineering, Louisiana State University, Baton Rouge, Louisiana.

O12.3
Theoretical and Numerical Stability Analysis of Multi-Layer Coatings Deposited on Soft Polymer Substrates. Shu Guo, Chris M. Stafford and Martin Y. M. Chiang; Polymer Division, National Institute of Standards and Technoloy, Gaithersburg, Maryland.

O12.4
Transferred to O13.5

O12.5
Defect Nucleation and Crack Propagation in Thin Films. Daniel Pantuso¹, Boris Voinov², Murali Seshadri¹, Sarangapani Sista¹, Sadasivan Shankar¹ and Victor Bashurin²; ¹Intel Corporation, Hillsboro, Oregon; ²Intel Corporation, Sarov, Russian Federation.

O12.6
Fracture and Deformation of Thermal Oxide Films on Si(100) Using a Femtosecond Pulsed Laser. Joel P. McDonald¹, Vanita Mistry², Katherine Ray² and Steve Yalisove³; ¹Applied Physics, University of Michigan, Ann Arbor, Michigan; ²College of Engineering, University of Michigan, Ann Abor, Michigan; ³Materials Science and Engineering, University of Michigan, Ann Abor, Michigan.

O12.7
Effects of Humidity History of the Tensile Deformation Behaviour in Poly(methyl methacrylate) (PMMA) Films. Chiemi Ishiyama and Yakichi Higo; P & I Laboratory, Tokyo Institute of Technology, Yokohama, Japan.

O12.8
Texture Control During Low Energetic Growth of Copper Thin Films. Moneesh Upmanyu and Liang Haiyi; Engineering Division, Materials Science Program, Colorado School of Mines, Golden, Colorado.

O12.9
Structural Control of Lithium Fluoride Thin Films. Ozgur G. Yazicigil^1,3, Dena Rafik², Vassili Vorontsov² and Alexander H. King¹; ¹School of Materials Engineering, Purdue University, West Lafayette, Indiana; ²Materials Department, Imperial College, London, United Kingdom; ³Intel Corporation, Hillsboro, Oregon.

O12.10
Role of Stress on the Phase Control and Dielectric Properties of (1-x) BiFeO₃-x Ba_0.5Sr_0.5TiO₃ Solid Solution Thin Films. Chin Moo Cho, Hee Bum Hong and Kug Sun Hong; Materials Science and Engineering, Seoul National University, Seoul, South Korea.

O12.11
Influence of Precursor Composition on the Chemical Vapor Deposition of MgAl2O4 Oxides. Sanjay Mathur, Hao Shen, Eva Hemmer and Thomas Ruegamer; Leibniz Institute of New Materials, Saarbruecken, Germany.

O12.12
Precipitation of Macroscopically Compound-Curved Graphite from Molten Metal. Steven Mason Winder and Jonathan W. Bender; Chemical Engineering, University of South Carolina, Columbia, Columbia, South Carolina.

O12.13
Residual Stresses in Anatase-TiO₂ Thin Films Deposited on Glass, Sapphire and Si Substrates. Ibrahim A. Al-Homoudi¹, Linfeng Zhang², M. H. Rahman³, D. G. Georgiev², R. Naik⁴, V. M. Naik⁵, R. J. Baird², L. Rimai², G. W. Auner² and G. Newaz¹; ¹Mechanical Engineering, Wayne State University, Detroit, Michigan; ²Electrical and Computer Engineering, Wayne State University, Detroit, Michigan; ³Chemical Eng. and Materials Science, Wayne State University, Detroit, Michigan; ⁴Physics and Astronomy, Wayne State University, Detroit, Michigan; ⁵Natural Sciences, University of Michigan-Dearborn, Dearborn, Michigan.

O12.14
Nano-Scale Material by Design. Deborah A. Bleau¹, Eric T. Eisenbraun^1,2 and Stephen B. Smith¹; ¹Launcher Technology Division, Benet Laboratories, Watervliet, New York; ²Albany NanoTech, Albany, New York.

O12.15
Influence of Stress on Structural and Dielectric Anomaly of Bi₂(Zn_1/3Ta_2/3)₂O₇ Thin Film. Jun Hong Noh, Hee Bum Hong and Kug Sun Hong; Materials Science and Engineering, Seoul National University, Seoul, South Korea.

O12.16
Improvement of Structural Properties of CdTe/Si for Photonic Applications. Svetlana Neretina¹, N. V. Sochinskii² and P. Mascher¹; ¹Center for Electrophotonic Materials and Devices (CEMD), Department of Engineering Physics, McMaster University, Hamilton, Ontario, Canada; ²Instituto de Microelectronica de Madrid-CNM-CSIC, Madrid, Spain.

O12.17
Stress Evolution During Solid State Reactions on Silicon. Davy Deduytsche¹, Charlotte Van Bockstael¹, Christophe Detavernier¹, Roland Vanmeirhaeghe¹ and Christian Lavoie²; ¹Solid State Physics, University Ghent, Ghent, Belgium; ²IBM T.J. Watson Research Center, Yorktown Heights, New York.

O12.18
Residual Stress and Microstructure Properties of Cu/Ta Multilayer Thin Films. Ming-Hsin Cheng¹, T. C. Cheng¹, W. J. Huang¹, C. C. Hsu¹, M. N. Chang¹ and M. K. Chung²; ¹National Nano Device Laboratories, Hsinchu, Taiwan; ²Panalytical, Taipei, Taiwan.

O12.19
Stress and Grain Size Effects on Epitaxial PZT Thin Films. Oscar Blanco¹ and Jesus Heiras²; ¹CIM, Universidad de Guadalajara, Guadalajara, Jal., Mexico; ²CCMC, Univ. Nacional Autonoma de Mexico, Ensenada, BC, Mexico.

O12.20
Contribution of Internal Strain and Ru-Deficiency to Magnetic and Surface Properties of SrRuO3 Thin Films. Young Zo Yoo¹, Omar Chmaissem¹, Alan Genis², Gregg Westberg², Michael Haji-Sheikh², Stanislaw Kolesnik¹, Dennis E. Brown¹, Bogdan Dabrowski¹ and Clyde W. Kimball¹; ¹Physics Department, Northern Illinois University, Dekalb, Illinois; ²Electrical Engineering Department, Northern Illinois University, Dekalb, Illinois.

O12.21
Failure Analysis of Thermally Shocked NiCr Films on Mn-Ni-Co Spinel Oxide Substrates. Min-Seok Jeon, Jun-Kwang Song, Yong-Nam Kim, Hyun-Gyu Shin and Hee-Soo Lee; Korea Testing Laboratory, Seoul, South Korea.

O12.22
Influence of Energetic Particles on the Microstructure and Stress State of Sputtered Thin Films. Aurelien Debelle, Anny Michel, Gregory Abadias and Christiane Jaouen; Laboratoire de Metallurgie Physique, Futuroscope-Chasseneuil Cedex, France.

O12.23
Cr Films Sputter-Deposited from a Line-Source onto Tilted Substrates. S. Yu. Grachev¹, J.-D. Kamminga¹ and G. C. A. M. Janssen²; ¹Netherlands Institute for Metals Research, Delft, Netherlands; ²Department of Materials Science and Engineering, Delft University of Technology, Delft, Netherlands.

O12.24
The Effect of Porogen on Physical Properties in MTMS-BTMSE Spin-on Organosilicates. Byung Ro Kim, Jeong-Man Son, Jungwon Kang, Kiyoul Lee, Gwigwon Kang and Minjin Ko; LG Chem, Daejeon, South Korea.

SESSION O13: Characterizing and Understanding Thin Film Growth Stresses
Chair: Junichi Koike
Friday Morning, April 1, 2005
Room 2022 (Moscone West)
8:30 AM *O13.1
The Effects of Atomic and Nano-Scale Processes on Growth Stresses in Thin Films. Carl V. Thompson¹, Cody A. Friesen^1,2, Reiner Moening¹ and Jeffery Leib¹; ¹Materials Science and Engineering, MIT, Cambridge, Massachusetts; ²Arizona State University, Tempe, Arizona.

9:00 AM O13.2
Stress Evolution During Electrodeposition of Ni Thin Films. Sean J. Hearne and Jerrold A. Floro; Sandia National Labs., Albuquerque, New Mexico.

9:15 AM O13.3
"In situ" Nanocomposite Formation in Low-Energy Nitrogen Ion Implanted Vanadium-Titanium Alloys. The Role of Sample Temperature on the Microstructure and Tribological Properties. Carmen Ballesteros¹, M. I. Ortiz², J. A. Garcia³, M. Varela¹, J. P. Riviere⁴ and R. Rodriguez³; ¹Fisica, U. Carlos III de Madrid, Leganes, Madrid, Spain; ²Tecnologia Electronica, ETSIT- U. Politecnica de Madrid, Madrid, Spain; ³Centro de Ingenieria Avanzada de Superficies, A.I.N., Cordovilla, Pamplona, Navarra, Spain; ⁴Laboratoire de Metallugie Physique, U.Poitiers U.M.R. 6630 CNRS, Futurscope-Chasseneuil, France.

9:30 AM O13.4
Chemical and Mechanical Stability of Driven Interfacial Alloys Under Ion Irradiation of Mo/Ni Multilayers. Gregory Abadias¹, Christiane Jaouen¹, Franck Martin¹, Jerome Pacaud¹, Philippe Djemia³ and Francois Ganot^2,3; ¹Laboratoire de Metallurgie Physique, UMR 6630, Universite de Poitiers, Futuroscope-Chasseneuil, France; ²Laboratoire des Milieux Desordonnes et Heterogenes, Universite Pierre et Marie Curie, Paris, France; ³LPMTM, Universite Paris-Nord, Paris, France.

9:45 AM O13.5
Nonlinear Transient Finite Element Analysis of the Relaxation Mechanisms in Strained Silicon Grown on SiGe Virtual Substrate. Faouzia Sahtout Karoui, A. Karoui and G. A. Rozgonyi; Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina.

10:00 AM BREAK

SESSION O14: Thin Film Processing
Chair: Eric Stach
Friday Morning, April 1, 2005
Room 2022 (Moscone West)

10:30 AM O14.1
Hafnium Diboride Nanostructured Hard Coatings from Chemical Vapor Deposition of the Single Source Precursor Hf[BH₄]₄. Sreenivas Jayaraman^1,3, Yu Yang^1,3, Abhishek Chatterjee^1,3, Pascal Bellon^1,3, Do Young Kim^2,3, Gregory S. Girolami^2,3 and John R. Abelson^1,3; ¹Department of Materials Science and Engineering, University of Illinois, Urbana, Illinois; ²Chemistry, University of Illinois, Urbana, Illinois; ³Fredrick Seitz Materials Research Laboratory, University of Illinois, Urbana, Illinois.

10:45 AM O14.2
ABSTRACT WITHDRAWN

11:00 AM O14.3
Passive Layer Formation at Ferroelectric PbTiO3/Pt Interfaces Studied by EELS. Lianfeng Fu¹, Sascha Welz¹, Rolf Erni¹, Masaki Kurasawa³, Paul C. McIntyre³ and Nigel D. Browning^1,2; ¹Chemical Engineering and Materials Science, University of California at Davis, Davis, California; ²National Center for Electron Microscopy, MS 72-150, Lawrence Berkeley National Laboratory, Berkeley, California; ³Materials Science and Engineering, Stanford University, Stanford, California.

11:15 AM O14.4
Growth Stress and Alloying Effect in Superlattices: A Comparison Between Sputtering and Thermal Evaporation. Aurelien Debelle, Gregory Abadias, Anny Michel and Christiane Jaouen; Laboratoire de Metallurgie Physique, Futuroscope-Chasseneuil Cedex, France.

11:30 AM O14.5
Kinematics Analysis and Correlation with Residual Stress of the Ni/Si System on Thin Film in MOS Technology. Florian Cacho^1,2, Delphine Aime¹, Francois Wacquant¹, Georges Cailletaud² and Herve Jaouen¹; ¹Mechanical Modeling, STMicroelectronics, Crolles, France; ²Mechanical Modeling, Centre des Materiaux, EVRY.

11:45 AM O14.6
Thermal Stress Relaxation of Plasma Enhanced Chemical Vapour Deposition Silicon Nitride. Pierre Morin, Emmanuel Martinez, Francois Wacquant and Jorge Regolini; ST Microelectronics, Crolles, France.