Chairs
| Jeremy Theil |
|
Lumileds,
LLC |
| Travis Blalock |
|
University of Virginia |
| Markus Boehm |
|
Universitat Siegen |
| Donald S. Gardner |
|
Intel Corporation |
Symposium Support
Agilent Technologies
University of Siegen-Center for Micro- and Nanochemistry & Engineering University of Virginia Dept of Electrical and Computer Engineering
Proceedings
to be published online
(see ONLINE PUBLICATIONS at www.mrs.org)
as volume 869E
of the Materials Research Society
Symposium Proceedings Series.
This volume may be published in print format after the
meeting.
* Invited paper
SESSION D1: Performance Imager and Detector Arrays
Chair: Markus Boehm
Tuesday Morning, March 29, 2005
Room 2008 (Moscone West)
8:30 AM D1.1
Influence of Design Parameters on Dark Current of Vertically Integrated a-Si:H Diodes. Clement Miazza1, Nicolas Wyrsch1, Gregory Choong1, Sylvain Dunand1, Arvind Shah1, Christophe Ballif1, Rolf Kaufmann2, Nicolas Blanc2, Mathieu Despeisse3 and Pierre Jarron3; 1Insititute of Microtechnology, University of Neuchatel, Neuchatel, Switzerland; 2Photonics Division, CSEM SA, Zurich, Switzerland; 3EP Division, CERN, Geneva, Switzerland.
8:45 AM *D1.2
Vertical Integration of Hydrogenated Amorphous Silicon on CMOS Circuits. Nicolas Wyrsch1, C. Miazza1, C. Baliff1, A. Shah1, N. Blanc2, R. Kaufmann2 and P. Jarron3; 1IMT, University of Neuchatel, Neuchatel, Switzerland; 2CSEM SA, Zurich, Switzerland; 3CERN Meyrin, CERN, Geneva, Switzerland.
9:15 AM D1.3
Reduction of Residual Transient Photocurrents in a Si:H Elevated Photodiode Array Based CMOS Image Sensors. Jeremy Theil, Agilent Technologies, Santa Clara, California.
9:30 AM *D1.4
Thin Film on ASIC (TFA) - A Technology for Ambitious Image Sensor Applications. Juergen Sterzel, Jena-Optronik GmbH, Jena, Germany.
10:00 AM BREAK
10:30 AM *D1.5
Monolithic Integration of Electronics and Subwavelength Metal Optics in Deep Submicron CMOS Technology. Peter B. Catrysse; Department of Electrical Engineering, E. L. Ginzton Laboratory, Stanford University, Stanford, California.
11:00 AM D1.6
Thin Film Color Sensor Arrays. Dietmar Knipp2,1, Robert A. Street2, Helmut Stiebig3, Mathias Krause3,4, Jeng P. Lu2, Steve Ready2 and Jackson Ho2; 1Science and Engineering, International University Bremen, Bremen, Germany; 2Electronic Materials Laboratory, Palo Alto Research Center, Palo Alto, California; 3Institute of Photovoltaics, Research Center Juelich, Juelich, Germany; 4Infineon Technologies, Dresden, Germany.
11:15 AM D1.7
Integration of Zinc Oxide Thin Films and Nanostructures
in Polymer-Based Devices. Masashi Matsumura1,
Zvonimir Z. Bandic2 and Renato P. Camata1; 1Dept.
of Physics, Univ. of Alabama at Birmingham, Birmingham, Alabama; 2Hitachi
San Jose Research Center, San Jose, California.
11:30 AM D1.8
Infra-Red Photo-Detectors Monolithically Integrated with
Silicon-Based Photonic Circuits. J. D. Bradley, P. E. Jessop and Andy Peter Knights; Engineering Physics, McMaster University, Hamilton, Ontario, Canada.
11:45 AM D1.9
Direct Growth of Ge on Si by Molecular Beam Epitaxy for CMOS Integrated Long Wavelength Optical Devices. Yu-Hsuan Kuo1, Xiaojun Yu1, Junxian Fu1, Theodore I. Kamins2, Glenn S. Solomon1 and James S. Harris1; 1Solid State and Photonics Lab, Stanford University, Stanford, California; 2Hewlett-Packard Laboratories, Palo Alto, California.
SESSION D2: Fabrication for 3D Devices
Chairs: Travis Blalock and Nicolas Wyrsch
Tuesday Afternoon, March 29, 2005
Room 2008 (Moscone West)
1:45 PM D2.1
Study
of Sputtered Hafniumoxide-Films for Sensor Applications.
Christian Kunath1, Heinrich Grueger1,
Eberhard Kurth1, Stephan Sorge1, Wolfram
Pufe1 and Torsten Pechstein2; 1Fraunhofer
IPMS, Dresden, Germany; 2E+H Conducta, Waldheim,
Germany.
2:00 PM D2.2
Blue Phosphorescent Cyclometalated Iridium Complexes Derived
from Phenylpyrazole Derivatives: Synthesis, Density Functional
Theory (DFT) Calculations and Organic Light-Emitting Diodes
Study. Tae-Hyuk Kwon1, Myoung-Chul Um1,
Myoung Ki Kim1, Hyo Soon Cho1, Su-youn
Choi1, Kwan Hee Lee2, Su Jin Park2
and Jong-In Hong1; 1School of Chemistry,
Seoul National University, Seoul, South Korea; 2Coperate
R&D Center, Samsung SDI, Seoul, South Korea.
2:15 PM D2.3
Application of Magnetic Ferrite Electrodeposition and Copper
Chemical Mechanical Planarization for On-Chip RF Circuitry.
Santosh K. Kurinec1, Cody Washburn1,
Daniel Brown2, Jay Cabacungan1 and Jayanti
Venkataraman2; 1Microelectronic Engineering,
RIT, Rochester, New York; 2Electrical Engineering,
RIT, Rochester, New York.
2:30 PM D2.4
RF Hollow Cathode Plasma Jet Deposition of BaxSr1-xTiO3.
Natale J. Ianno1, Rodney Joseph Soukup1,
Noel Lauer1 and Zdenek Hubicka2; 1Electrical
Engineering, University of Nebraska, Lincoln, Nebraska; 2Division
of Optics, Academy of Sciences of the Czech Republic, Prague,
Czech Republic.
2:45 PM D2.5
Optimization of the Metal/Silicon Ratio on Nickel Assisted
Crystallization of Amorphous Silicon. Luis Pereira,
Francisco Braz Fernandes, Elvira Fortunato and Rodrigo Martins;
Materials Science Department, CENIMAT/CEMOP, Caparica, Portugal.
3:00 PM BREAK
3:15 PM *D2.6
Integrated Optical Sensing for Biological Analysis. Evan
Thrush1,2, Ofer Levi2, Jonathan Ziebarth2,
James S. Harris2, Stephen J. Smith3 and
Mike McGehee4; 1Agilent Technologies,
Palo Alto, California; 2Department of Electrical
Engineering, Stanford University, Stanford, California; 3Department
of Molecular and Cellular Physiology, Stanford University, Stanford,
California; 4Department of Material Science, Stanford
University, Stanford, California.
3:45 PM D2.7
Co-Firing of Low- and High- Permittivity Dielectric Tapes
for Multifunctional Low-Temperature Co-Fired Ceramics. Jae-Hwan
Park, Young-Jin Choi and Jae-Gwan Park; Korea Institute
of Science and Technology, Seoul, South Korea.
4:00 PM D2.8
Making Wafer Bonding Viable for Mass Production. Cher-Ming
Tan1, Weibo Yu1 and Jun Wei2;
1School of EEE, Nanyang Technological University,
Singapore, Singapore; 2Singapore Institute of Manufacturing
Technology, Singapore, Singapore.
4:15 PM D2.9
Low Temperature Deposition of Indium Tin Oxide(ITO) Films
on Plastic Substrates. Vandana Singh, B. Saswat and Satyendra
Kumar; SCDT, IIT Kanpur, IIT Kanpur, Kanpur, Uttar Pradesh,
India.
4:30 PM D2.10
In-situ Spectroscopic Impedance of Different Transparent
Conductive Oxides Before and After Sustaining Hydrogen Plasma.
I. Ferreira, L. Raniero, R. Igreja, A. Pimentel, A.
Goncalves, E. Fortunato and R. Martins; Department of Materials
Science,
New University of Lisbon and CEMOP-UNINOVA, Caparica, Portugal.
4:45 PM D2.11
Preparation of ITO Thin Films for OLED Application with
O2 Gas by FTS (Facing Targets Sputtering) System. HyunWoong
Kim, GeonHi Kim, MinJong Keum and KyungHwan Kim; Kyungwon
Univ., KyungGi-Do, South Korea.
SESSION D3: Chemical Detection and Manipulation Systems
Chairs: Mark Brongersma and Jeremy Theil
Wednesday Morning, March 30, 2005
Room 2008 (Moscone West)
8:30 AM *D3.1
Integration of Fluidic and Photonic Functional Elements for
More Versatile Lab-On-A-Chip Systems. Jorg P. Kutter,
Klaus B. Mogensen, Detlef Snakenborg, Fredrik Eriksson, Omar
Gustafsson, Thorbjorn Anderson and Henning Klank; MIC - Dept.
of Micro and Nanotechnology, Technical University of Denmark,
Lyngby, Denmark.
9:00 AM D3.2
Macroporous Silicon Sensor Arrays for Chemical and Biological
Detection. Karl D. Hirschman1, Vimalan
Rajalingam1, Jeffrey Clarkson1, Wei Sun2
and Philippe M. Fauchet2; 1Microelectronic
Engineering, Rochester Intsitute of Technology, Rochester, New
York; 2Electrical and Computer Engineering, University
of Rochester, Rochester, New York.
9:15 AM *D3.3
Monolithic Liquid Chemical Sensing Systems. Steven
M. Martin1, Timothy D. Strong2 and
Richard B. Brown3; 1Electrical Engineering,
University of Michigan, Ann Arbor, Michigan; 2Sensicore,
Ann Arbor, Michigan; 3Electrical Engineering, University
of Utah, Salt Lake City, Utah.
9:45 AM *D3.4
A
CMOS Medium Density DNA Microarray with Electronic Readout.
Roland Thewes1, C. Paulus1, M.
Schienle1, F. Hofmann1, A. Frey1,
P. Schindler-Bauer1, M. Atzesberger1,
B. Holzapfl1, G. Beer2, T. Haneder1
and H.-C. Hanke1; 1Infineon Technologies
AG, Munich, Germany; 2Infineon Technologies AG, Regensburg,
Germany.
10:15 AM BREAK
10:30 AM *D3.5
An Electronic Nose from Arrays of Polymer Composite Vapor
Sensors. Nathan S. Lewis, Division of Chemistry and
Chemical Engineering, California Institute of Technology, Pasadena,
California.
11:00 AM D3.6
External Coupling of Molecular Dye Emission to High-Q Microdisk
Resonators. David R. Rink1, Michael H.
Bartl4,2, Lidong Zhang4, Galen D. Stucky2
and Evelyn L. Hu1,3,4; 1Electrical and
Computer Engineering, UC Santa Barbara, Santa Barbara, California;
2Chemistry and Biochemistry, UC Santa Barbara, Santa
Barbara, California; 3Materials, UC Santa Barbara,
Santa Barbara, California; 4California NanoSystems
Institute, UC Santa Barbara, Santa Barbara, California.
11:15 AM *D3.7
Some Recent Applications Colorimetric Sensor Arrays.
Ken Suslick, Michael Janzen, Jennifer B. Wilson and Chen
Zhang; Chemistry, University of Illinois, Urbana, Illinois.
11:45 AM D3.8
A Novel Technology to Create Monolithic Instruments for Micro
Total Analysis Systems. Konstantin Seibel, Lars Schoeler,
Marcus Walder, Heiko Schaefer, Dietmar Ehrhardt and Markus
Boehm; Institute for Microsystem Technology, University
of Siegen, Siegen, Germany.
SESSION D4: Photonic Systems
Chair: Don Gardner
Wednesday Afternoon, March 30, 2005
Room 2008 (Moscone West)
1:30 PM D4.1
Integration of Polymer Pillar Optical Interconnects with
Group IV MSM Photodetectors. Ali K. Okyay1,
Chi On Chui1, Muhannad S. Bakir2, James
D. Meindl2 and Krishna C. Saraswat1;
1Electrical Engineering, Stanford University, Stanford,
California; 2Electrical and Computer Engineering,
Georgia Institute of Technology, Atlanta, Georgia.
1:45 PM *D4.2
Liquid Crystal on Silicon Devices. Mark A. Handschy1
and Timothy J. Drabik2; 1Displaytech,
Inc., Longmont, Colorado; 2Page Mill Technology
Corp., Palo Alto, California.
2:15 PM D4.3
Surface Acoustic Wave-Induced Electroluminescence Intensity
Oscillation in Planar Light-Emitting Devices. Marco
Cecchini1, Vincenzo Piazza1, Fabio
Beltram1, Martin Ward2, Andrew Shields2,
Harvey Beere3 and David Ritchie3; 1Scuola
Normale Superiore and NEST-INFM, Pisa, Italy; 2Toshiba
Research Europe Limited, Cambridge, United Kingdom; 3Cavendish
Laboratory, Cambridge, United Kingdom.
2:30 PM D4.4
Efficient Focusing with an Ultra-Low Effective-Index Lens
Based on Photonic Crystals. Eugen Foca1,
V. V. Sergentu2, Helmut Foell1, Juergen
Carstensen1, Frank Daschner1, Reinhard
Knoechel1 and I. M. Tiginyanu2; 1Chair
for General Materials Science, Faculty of Engineering, Christian-Albrechts-University
of Kiel, Kaiserstr. 2, 24143 Kiel, Germany; 2Institute
of Applied Physics, Technical University of Moldova, 2004
Chisinau, Moldova.
2:45 PM D4.5
MBE Growth of High Quality GaAs on Si Through Direct Ge
Buffers. Xiaojun Yu, Yu-Hsuan Kuo, Junxian Fu and
James S. Harris; Solid State and Photonics Laboratory, Stanford
University, Stanford, California.
3:00 PM BREAK
3:30 PM D4.6
Luminescent Si Nanocrystals Formed Within Silicon Rich
Silicon Oxide Thin Films. Tyler Roschuk1,2,
Michael Flynn1,2, Jacek Wojcik1,2, Othman
Zalloum1,2, Edward Irving1,2 and Peter
Mascher1,2; 1Engineering Physics, McMaster
University, Hamilton, Ontario, Canada; 2Centre
for Electrophotonic Materials and Devices, McMaster University,
Hamilton, Ontario, Canada.
3:45 PM *D4.7
Towards CMOS Compatible Nanophotonics. Mark Brongersma,
Rashid Zia, Anuranjita Tewary, Anu Chandran, Ragip Pala, John
Liu, John Schuler, Alex Guichard, Rohan D. Kekatpure, Andrew
Carlson, Benjamin Reddy, David N. Barsic, Peter B. Catrysse
and Mark D. Selker; Geballe Laboratory for Advanced Materials,
Stanford University, Stanford, California.
4:15 PM D4.8
ABSTRACT WITHDRAWN
4:30 PM D4.9
Improved Luminescent Efficiency of PDP Blue Phosphor by
Microwave Irradiation. Shu-Ping Lee, Chin-Ching
Lin, Kuan-Ting Kuo and San-Yuan Chen; Materials Science and
Engineering, National Chiao-Tung University, Hsinchu, Taiwan.
4:45 PM D4.10
Tungsten Oxide Nanoribbons Fabricated in Moisturized Environment.
Yiu WingChing1,2, Hong HunQuan1,2,
Wu HuaSheng1,2, Xie MaoHai1,2, Wei ZhiFeng1
and Xu ShiJie1; 1Department of Physics,
The University of Hong Kong, Hong Kong, China; 2CAS
and HKU Joint Laboratory on New Materials, Hong Kong, China.
Symposium Organizers
Jeremy Theil
Lumileds, LLC
MS 91UJ
370 W. Trimble Rd.
San Jose, CA 95131
Tel: 408 435-6233
Fax: 408 435-6012
jeremy.theil@lumileds.com |
Travis Blalock
University of Virginia
Dept. of Electrical and Computer Engineering
C215 Thornton Hall
351 McCormick Rd.
Charlottesville, VA 22904-4743
Tel: 434-924-1331
Fax: 434-924-8818
blalock@virginia.edu |
Markus Boehm
Universität Siegen
Institut für Mikrosystemtechnik
Hoelderlinstr. 3
Siegen D-57068, Germany
Tel: 49-271-740-3293
Fax: 49-271-740-4512
markus.boehm@uni-siegen.de |
Donald S. Gardner
Intel Corporation
MS SC1-03
2200 Mission College Blvd.
Santa Clara, CA 95054
Tel: 408-765-2025
d.s.gardner@intel.com |
|