As the integrated circuit industry strives to produce smaller and faster parts with increased functionality, novel materials, processes, integrations, and packages are being researched, developed, and qualified for manufacturing. Copper metallization and low-k dielectrics are now commonplace in advanced high-performance interconnects; but, as physical dimensions are scaled for future technology nodes, it is expected that performance requirements will necessitate the introduction of novel metallization and dielectrics. Associated with the integration of such materials in high-performance interconnects is a plethora of process and reliability issues including interface integrity, stress migration, electromigration, leakage, time-dependent dielectric breakdown, as well as thermal and mechanical fatigue. This symposium will explore challenges with depositing, characterizing, and integrating novel and existing barriers, metals, and ultralow-k dielectrics into reliable high-performance interconnects that can be robustly packaged. This symposium will also address novel metrology for characterizing materials such as porous dielectrics and ultrathin barriers.
Session Topics
Topics of interest that will be included in this symposium include, but are not limited to:
- Materials issues associated with processing, integration and deposition of low- k dielectrics and interconnect metallizations
- Advanced and novel integration schemes
- Novel materials for low- k dielectrics
- Development and integration of ultralow- k dielectrics and issues with porosity (mechanical strength, adhesion, pore sealing, and process control)
- Novel etch-stop and barrier layers
- Challenges with chemical-mechanical polishing and planarity
- Techniques for characterizing barriers, metals, and low- k dielectrics
- Mechanical properties, adhesion, and stress issues of dielectrics and metals
- Microstructure of ultrathin barriers, interconnects, and underbump metallurgy
- Novel methods and test structures for evaluating materials properties and reliability
- Reliability issues for barriers, dielectrics, and Cu interconnects, including stress migration, electromigration, leakage, and fatigue
- New methodologies for testing and analyzing electrical, reliability, and mechanical failures
- Terminal metallurgy schemes and novel BUMP metallurgical issues
- Modeling and testing of chip-package interactions
- Novel packaging methods and wafer-level packaging
- Optical interconnects
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Invited Speakers
Invited speakers include: Sywert Brongersma (IMEC, Belgium), Reinhold Dauskardt (Stanford Univ.), Christine Hau-Riege (AMD), Paul Ho (Univ. of Texas), Young-Chang Joo (Seoul National Univ., Korea), Hermann Oppermann (Fraunhofer Inst., Germany), Ray Pearson (Lehigh Univ.), Todd Ryan (IBM-AMD-Sony-Toshiba Alliance), Tom Shaw (IBM), Z. Suo (Harvard Univ.), and Ting Tsui (Texas Instruments). |
Joint Sessions
Joint sessions are anticipated with Symposia O: Thin Films–Stresses and Mechanical Properties XI , and Symposia W: Chemical Mechanical Planarization–Integration, Technology, and Reliability . |
Tutorial Session
| A tutorial complementing this symposium is tentatively planned. Further information will be included in the program that will be available in January. (Find out more about the 2005 MRS Spring Meeting Tutorial Program.) |
Symposium Organizers
Paul R. Besser
Advanced Micro Devices, Inc.
MS 36
One AMD Pl.
Sunnyvale, CA 94088
Tel: 408-749-2350
Fax: 408-774-8818
paul.besser@amd.com |
Andrew J. McKerrow
Texas Instruments, Inc.
MS 3736
13560 N. Central Expwy.
Dallas , TX 75243
Tel: 972-927-1017
Fax: 972-995-6383, mckerrow@ti.com |
C. P. Wong
Georgia Institute of Technology
School of Materials Science & Engineering
771 Ferst Dr. NW
Atlanta, GA 30332-0245
Tel: 404-894-8391
Fax: 404-894-9140
cp.wong@mse.gatech.edu |
Joost Vlassak
Harvard University
Pierce Hall 311
29 Oxford St.
Cambridge, MA 02138
Tel: 617-496-0424
Fax: 617-495-9837
vlassak@esag.harvard.edu |
Francesca Iacopi
IMEC
Kapeldreef 75
B-3001 Leuven, Belgium
Tel: 32-16-28-1846
Fax: 32-16-28-1214
francesca.iacopi@imec.be |
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