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Selected Presentations
Symposia G, I, X, Y, FF
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SYMPOSIUM G
Luminescence and Luminescent Materials

G4.8
LUMINESCENCE OF DOPED ZnSe NANOCRYSTALS
J.F. Suyver, S.F. Wuister, J.J. Kelly, A. Meijerink, Debye Institute, Physics and Chemistry of Materials, Utrecht University, THE NETHERLANDS.

 

SYMPOSIUM I
Wafer Bonding and Thinning Techniques for Materials Integration

*I2.3
MOLECULAR DYNAMICS SIMULATIONS OF WAFER BONDING
Kurt Scheerschmidt, Max Planck Institute of Microstructure Physics, Halle, GERMANY.

*I3.4
SLICING AND BONDING OF SINGLE-CRYSTAL FERRO- ELECTRIC AND MAGNETIC OXIDE FILMS
M. Levy, Michigan Technological University, Dept of Physics, Houghton, MI; T. Izuhara, A. Radojevic, R.M. Osgood, Jr., Columbia University, Dept of Applied Physics, New York, NY; M. Reeves, George Washington University, Dept of Physics, Washington, DC; H. Bakhru, SUNY at Albany, Dept of Physics, Albany, NY.

*I6.1
INTEGRATION OF InGaN-BASED OPTOELECTRONICS WITH DISSIMILAR SUBSTRATES BY WAFER BONDING AND LASER LIFT-OFF
William S. Wong, Michael Kneissl, David W. Treat, Mark Teepe, Naoko Miyashita, Noble M. Johnson, Xerox PARC, Palo Alto, CA.

*I6.4
PHOTONIC CRYSTAL FABRICATION BY A WAFER BONDING APPROACH
Susumu Noda, Dept of Electronic Science and Engineering, Kyoto University, Kyoto, JAPAN

I7.2
MULTIPLE WAFER BONDING FOR MEMS APPLICATIONS
M. Reiche, Max Planck Institute of Microstructure Physics, Halle, GERMANY; M. Haueis, J. Dual, ETH Zürich, Institut of Mechanics, Zürich, SWITZERLAND; C. Cavalloni, Kistler Instrumente AG, Winterthur, SWITZERLAND; R. Buser, Interstate University of Applied Science Buchs, Buchs, SWITZERLAND.

*I8.2/D8.2
BONDING, SPLITTING AND THINNING BY POROUS Si IN ELTRAN™ SOI-Epi Wafers™
Kenji Yamagata and Takao Yonehara, ELTRAN Business Center, Canon Inc., Kanagawa, JAPAN

I9.1/D9.1
ORIENTATION AND BORON CONCENTRATION DEPENDENCE OF Si LAYER TRANSFER BY MECHANICAL EXFOLIATION
K. Henttinen, T. Suni and I. Suni, VTT Electronics, Microelectronics Center, Espoo, FINLAND; S.S. Lau, University of California-San Diego, Department of Electrical Computer Engr., La Jolla, CA.

I9.5/D9.5
GETTERING CONTROL AT BONDING INTERFACE IN ELTRAN™
K. Momoi, M. Ito, N. Sato, N. Honma and T. Yonehara, Canon Inc., ELTRAN Business Center, Kanagawa, JAPAN.

 

SYMPOSIUM X
Frontiers of Materials Research

12:45 PM *X1.2
NEW DIRECTIONS IN PHOTOPOLYMERIZABLE MATERIALS
Kristi S. Anseth, University of Colorado, Boulder, CO.

 

SYMPOSIUM Y
Synthesis, Functional Properties, and Applications of Nanostructures

Y1.6
A NOVEL LOW TEMPERATURE SYNTHESIS METHOD FOR SEMICONDUCTOR NANOWIRES
S. Sharma, M.K. Sunkara, R. Miranda, University of Louisville, Department of Chemical Engineering, Louisville, KY; G. Lian, E.C. Dickey, University of Kentucky, Department of Chemical and Materials Engineering, Lexington, KY.

Y2.4
STRUCTURAL, OPTICAL AND CHEMICAL PROPERTIES OF ZnS AND CdS NANOPARTICLES OBTAINED BY AN IMPROVED COLLOIDAL CHEMISTRY SYNTHETIC ROUTE
M.L. Curri, A. Agostiano, M. DellaMonica, C.S. CFILM - CNR, Bari, ITALY; G. Leo, M. Lomascolo, L. Vasanelli, IME - CNR, Lecce, ITALY.

Y5.7
GROWTH AND CHARACTERIZATION OF MAGNETIC NANO-WIRES ON CARBON NANOTUBE TEMPLATES
Yihong Wu, Peiwen Qiao, and Towchong Chong. National University of Singapore, SINGAPORE

Y6.7
NANOCOMPOSITE POLYMERIC ELECTROLYTES
Wadyslaw Wieczorek, D. Swierczynski, Aldona Zalewska, Zbigniew Florjanczyk, Norbert Langwald, Warsaw University of Technology, Faculty of Chemistry, Warsaw, POLAND

Y7.2/U6.2
SUPERPARAMAGNETISM AND MICROSTRUCTURAL PROPERTIES OF CARBON ENCAPSULATED Ni NANO- PARTICLE ASSEMBLIES
Xiang-Cheng Sun, J.A. Toledo, Prog. Simulación Molecular, Instituto Mexicano del Petróleo, México, MÉXICO; M.J. Yacaman, ININ, México, MÉXICO.

Y9.8
SURFACE MODIFICATION OF SUPERPARAMAGNETIC NANOPARTICLES WITH PEG FILMS AND MEMBRANE TRANSLOCATING PEPTIDES FOR PARTICLE IMPREGNATION IN CELLS
Yong Zhang, Nathan Kohler, Miqin Zhang, University of Washington, Seattle, WA.

 

SYMPOSIUM FF
Materials Problem Solving with the Electron Microscope

FF5.4
FABRICATION AND DEMONSTRATION OF A WET ELECTROCHEMICAL CELL FOR IN-SITU TEM ELECTROPLATING EXPERIMENTS
Mark J. Williamson, University of Virginia, Department of MSE, Charlottesville, VA; Frances Ross, S. Jay Chey, IBM TJ Watson Research Center, Yorktown Heights, NY.

* Invited Paper

 

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