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4:00 PM BB9.3
PROCESSING EFFECTS ON
MICROSTRUCTURE DEVELOPMENT DURING THERMAL SPRAYING.
Sanjay Sampath, Center for Thermal Spray Research, State
University of New York, Stony Brook, NY.
Thermal
spraying is a highly dynamic process resulting from rapid
heating/melting/accelerating of powder particles or wire in a flame,
followed by impact and rapid solidification of the droplet (splat).
The particles experience large thermal gradients in the flame during
its heating/melting which can lead to phase decomposition, species
volatilization and oxidation of metallic components. Due to the rapid
solidification nature of the process, deposit evolution is complex,
commonly leading to ultra-fine-grained and metastable microstructures.
Thus, the non-equilibrium phenomena are common in the microstructure,
with important implications for properties and performance. A splat
resulting from the flattening of an individual droplet is the basic
building block of the thermal spray microstructure. The phase and
microstructure of the splats and the integration of the splats are
both affected by processing. Furthermore, particle size and
deposition temperature have been shown to influence the
microstructure development. Thus, understanding and prediction of
phase/microstructure evolution by examining rapid solidification
provide insight into structure-property-performance triad. This
presentation will cover the deposit formation dynamics, the evolution
of the rapidly solidified microstructure, and provide case studies
to illustrate the relationships between processing-microstructure.
Implications of the effects on properties will also be discussed for
select systems.
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System Administrator
11/13/1997