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4:30 PM BB2.8
MODELING OF SPREADING AND
SOLIDIFICATION OF MOLTEN DROPLETS ON A COLD SUBSTRATE. H.
Zhang, V. Prasad, and S. Sampath, State University of New York,
Center for Thermal Spray Research and Process Modeling Laboratory,
Stony Brook, NY.
Several models have been developed
based on deforming finite-element method with adaptive grid
generation and finite difference based volume of fluid (VOF)
technique to study the spreading and solidification of splat(s).
Both schemes have their own advantages in modeling the spray coating
processes. The deforming finite element scheme is more accurate in
the tracking of the free surface and solidification interface.
However, it is very difficult to handle free surface merger and
separation. The phenomena of splashing can be better studied using
the VOF or other capturing scheme. To alleviate these problems and
build a numerical model capable of handling all aspects of spray
coating process, we have developed a high-resolution numerical scheme
based on finite volume front tracking method and level set
formulation (LSF). This model can predict more accurately the
melt/solid interface shape and its dynamics due to the use of the
front tracking scheme. The contact resistance and kinetics of
solidification can also be accounted for by using this scheme. The
deforming shape of the splat's free surface is captured by the
curvilinear level set function which is able to simulate the free
surface oscillations, merger and separation. Spreading and
solidification of one and two nickel droplets on a cold nickel
substrate are modeled and the effect of the splat temperature,
velocity, surface tension and rate of substrate cooling have been
investigated. The simulation begins at the time when the molten
droplet comes in contact with the substrate until the entire
droplet(s) has been solidified or the deposit layer has been formed.
The results have been compared with the analytical solutions of
Madejski as well as with the experimental data.
Next: Session BB2.9
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Previous: Session *BB2.7
System Administrator
11/13/1997