Innovative, cost-effective, and reliable printing methods are becoming central to the development and integration of diverse high-tech optical, photonic, electronic, optoelectronic, and bioinformatic materials and devices. Several printing methods promise a new generation of cost-effective and disposable devices that can be made in a roll-to-roll manufacturing process.
This symposium is to provide a forum for scientists and engineers working in related fields to exchange ideas and experiences on using traditional and novel printing techniques in areas related, but not limited, to optics, photonics, data storage, displays, bioinformatics, photovoltaics, optoelectronics, organic electronics, biosensors, lighting, and others.
Session Topics
Papers regarding the latest developments in the science and technology of printing techniques and the fabrication of active and passive devices and elements ranging in size from a few nanometers to several centimeters are solicited:
- Flexible substrates, electronics, and optoelectronics, including low-temperature CVD processes
- Novel nanoprinting and nano-imprinting methods, materials, and devices
- New characterization techniques for printing-related techniques
- Novel techniques for printing template and device fabrication
- Nanothick films and devices via Gravure and screen printing
- Ink-jet printing in device fabrication
- Printing of biomaterials and biosensors
- Nanomolding and embossing techniques and applications
- ‘Printing’ with scanning probes
- Unusual printing fabrication techniques for carbon-based nanoelectronics
- Nanoscale electrical contacts and nanoxerography
|
Tutorial Session
Invited Speakers
Invited speakers (tentative) include: A. Arias (PARC), M. Berggren (Linköping Univ., Sweden), P. Calvert (Univ. of Massachusetts), Y. Chen (Lab. de Photonique et Nanostructures, CNRS, France), Y. Chen (Univ. of California-Los Angeles), A. Chilkoti (Duke Univ.), S.Y. Chou (Princeton Univ.), P.-F. Fu (Dow Corning Corp.), D. Ginley (National Renewable Energy Lab), Y. Hirai (Osaka Prefecture Univ., Japan), A.J. Hunt (Univ. of Michigan), H. Kopola (VTT Electronics, Finland), H.H. Lee (Seoul National Univ., Korea), J. Lee (Ohio State Univ.), R. Nuzzo (Univ. of Illinois), A. Shim (Dow Corning Corp.), C. SotomayorTorres (Univ. College Cork, Ireland), G. Whitesides (Harvard Univ.), G. Willson (Univ. of Texas-Austin), Y. Yoshioka (Arizona State Univ.) and J. Zhang ( Motorola Advanced Technology Center). |
Symposium Organizers
L. Jay Guo
University of Michigan
Dept. of Electrical Engineering & Computer Science
3411 EECS
1301 Beal Ave.
Ann Arbor, MI 48109-2122
Tel: 734-647-7718
Fax: 734-763-9324
guo@eecs.umich.edu
|
Ghassan E. Jabbour
Arizona State University
Dept. of Chemical & Materials Engineering, and Flexible Display Center
Tempe, AZ 85284
Tel: 480-727-8930
Fax: 480-727-8957
jabbour@asu.edu
|
Arokia Nathan
University of Waterloo
Dept. of Electrical & Computer Engineering
200 University Ave.
W, Waterloo N2L 3G1, Canada
Tel: 519-888-4803
Fax: 519-746-6321
a.nathan@ece.uwaterloo.ca |
John A. Rogers
University of Illinois, Urbana-Champaign
Dept. of Materials Science, 1304 W. Green St.
Urbana, IL 61801
Tel: 217-244-4979
Fax: 217-333-2736
jrogers@uiuc.edu |
James W. Stasiak
Hewlett Packard Company
Technology Development Org.
MS 321A
1000 NE Circle Blvd.
Corvallis, OR 97330
Tel: 541-715-0917
Fax: 541-715-3785
james_stasiak@hp.com |
|
|
