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2003
MRS Fall Meeting MRS Symposium U: Thin Films-Stresses and Mechanical Properties X Understanding the mechanical behavior of thin films is crucial for a wide variety of technologies, including semiconductor devices and packaging (e.g., advanced interconnects, dielectrics, and silicides), information storage media, optical films, hard coatings, micro- and nanoelectromechanical systems (MEMS and NEMS), and biomedical devices. This behavior can critically influence the design, performance, and reliability of thin-film structures used in every area of thin-film technology. However, the performance of these devices is often limited by the mechanical properties of both the films and the structures to which they are attached. The concepts, models, and techniques developed for bulk materials often do not apply to small dimensions, and the mechanisms controlling behavior are not well defined. This symposium aims to bring together researchers involved in experimental and theoretical investigations in all aspects of the mechanical behavior of metal, polymer, and ceramic thin films and related structures to help provide this understanding. Of particular interest are those studies that cut across length scales such as atomistic-to-nanometer or nanometer-to-submicron scales. Any proposed synthesis of these findings into useful algorithms for more general industrial applications would also be welcome. Topics of interest include: ·
Processing-microstructure-mechanical property relationships Joint sessions are anticipated with Symposia A: Micro- and Nanosystems, and Q: Mechanical Properties of Nanostructured Materials and Nanocomposites. Invited speakers (tentative) include: David Bahr (Washington State Univ.), Eric Chason (Brown Univ.), Robert Cook (University of Minnesota), Oliver Kraft (Max-Planck-Inst. for Metals Research, Germany), and Timothy Weihs (Johns Hopkins Univ.). Symposium Organizers Sean
G. Corcoran Young-Chang
Joo Neville
R. Moody Zhigang
Suo
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