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MRS Symposium B: Materials, Integration, and Packaging Issues for High-Frequency Devices The fields of high-frequency materials, integration, and electronic packaging have been rapidly emerging in the last decade due to their significance particularly in the area of information technology and wireless communication. Progress in microelectronics technology is driven by the ability to dimensionally scale electrical systems; and, though the scaling of integrated circuits receives critical attention, most device real estates and potential size reduction will occur through passive component and package miniaturization, and eventually through on-chip integration in order to reduce the number of components. For example, the multifunctionality of modern electronic devices results from the integration of numerous elements in a miniaturized substrate package. A critical subset of these elements constitutes passive components having a variety of capacitive, inductive, and resistive functions. Some of the most significant progress involves low-temperature co-fired ceramics (LTCC), embedded passive components, tunable RF and microwave thin-film devices, and microwave resonator ceramics with the development of their associated packaging and interconnect technologies. In order to reflect the rapid market progress in this field, this symposium will provide an international interdisciplinary forum to address most recent progress in the research of novel electronic materials, integration, and packaging for high-frequency applications, particularly operating in the RF and microwave frequency range. Reports of investigations uncovering relationships among physical structures, electrical performance, and processing methods are most desired. The topics of the symposium include, but are not limited to: ·
Ceramic materials and technology for RF and microwave frequency devices A joint session is anticipated with Symposium C: Ferroelectric Thin Films XII Invited speakers (partial list) include: Daniel Amey (DuPont), William Borland (DuPont), Peter K. Davies (Univ. of Pennsylvania), Paul Franzon (North Carolina State Univ.), Bob Heistand (AVX Corp.), Mike Lanagan (Pennsylvania State Univ.), J.D. Larson (Agilent), Peter Loebl (Philips GmbH Forschungslab. Aachen, Germany), Gary Messing (Pennsylvania State Univ.), Christopher R. Needes (DuPont), Herbert Reichl (Technische Univ. Berlin, Germany), Nava Setter (Swiss Federal Inst. of Technology, Switzerland), Harrie Tilmans (IMEC, Belgium), Rao Tummala (Georgia Inst. of Technology), Joost van Beek (Philips Research Labs Eindhoven, The Netherlands), and Ki Hyun Yoon (Yonsei Univ., Korea). Symposium Organizers Yong
S. Cho Christian
Hoffmann J-P.
Maria Paul
Muralt Clive
A. Randall Mareike
Klee
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